Resin composition and method of forming resist pattern

Patent metadata

Field	Value
Publication number	US-11603459-B2
Application number	US-202117412518-A
Country	US
Kind code	B2
Filing date	Aug 26, 2021
Priority date	Nov 1, 2016
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

A resin composition includes a resin A, a resin C, and a solvent. The resin A includes a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A. The resin A has a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A. The resin C includes a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A. A content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass.

First claim

What is claimed is:

1. A resin composition comprising:
a resin A that comprises a sulfonic-acid-group-containing structural unit in an amount exceeding 5 mol % with respect to total structural units included in the resin A, the resin A having a content of a fluorine atom of 30 mass % or less with respect to a total mass of the resin A;
a resin C that comprises a fluorine atom in a larger content per unit mass than the content of a fluorine atom per unit mass in the resin A; and
a solvent,
wherein a content of the resin A in the resin composition is lower than a content of the resin C in the resin composition in terms of mass, and a content of the resin A in a total mass of resin solid components of the resin composition is 0.1 mass % or more and less than 5 mass %.

2. The resin composition according to claim 1 , wherein a content of the resin C in a total mass of resin solid components of the resin composition is 10 mass % or more and 98 mass % or less.

3. The resin composition according to claim 1 , wherein
the amount of a fluorine atom in the resin A with respect to a total mass of the resin A is 0 mass % or more and less than 30 mass %, and
the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

4. The resin composition according to claim 3 , wherein the resin A does not contain a fluorine atom.

5. The resin composition according to claim 1 , further comprising a resin B that comprises a sulfonic-acid-group-containing structural unit in an amount exceeding 0 mol % and being 5 mol % or less with respect to total structural units included in the resin B, the resin B having a content of a fluorine atom per unit mass smaller than the content of a fluorine atom per unit mass in the resin C.

6. The resin composition according to claim 5 , wherein the sulfonic-acid-group-containing structural unit in one or both of the resin A and the resin B is represented by Formula (1):

wherein in the Formula (1), Ra is a hydrogen atom or a methyl group, and Rb is a single bond or a divalent organic group.

7. The resin composition according to claim 6 , wherein in the Formula (1), Rb is a single bond, a divalent chain hydrocarbon group having 1 to 6 carbon atoms, a divalent aromatic hydrocarbon group having 6 to 12 carbon atoms, or —C(═O)—NH—R′— group wherein R′ is a divalent chain hydrocarbon group having 1 to 6 carbon atoms.

8. The resin composition according to claim 6 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 6 mol % to 45 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 1 mass % to 25 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

9. The resin composition according to claim 6 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 8 mol % to 40 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 5 mass % to 20 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

10. The resin composition according to claim 1 , wherein the resin C does not contain a sulfonic-acid-group-containing structural unit.

11. The resin composition according to claim 1 , wherein the resin A further comprises a carboxyl-group-containing structural unit.

12. The resin composition according to claim 1 , wherein a receding contact angle of a film formed from the resin composition, with respect to water, is 80° or more.

13. The resin composition according to claim 1 , wherein the sulfonic-acid-group-containing structural unit in the resin A is represented by Formula (1):

wherein in the Formula (1), Ra is a hydrogen atom or a methyl group, and Rb is a single bond or a divalent organic group.

14. The resin composition according to claim 13 , wherein in the Formula (1), Rb is a single bond, a divalent chain hydrocarbon group having 1 to 6 carbon atoms, a divalent aromatic hydrocarbon group having 6 to 12 carbon atoms, or —C(═O)—NH—R′— group wherein R′ is a divalent chain hydrocarbon group having 1 to 6 carbon atoms.

15. The resin composition according to claim 13 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 6 mol % to 45 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 1 mass % to 25 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

16. The resin composition according to claim 13 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 8 mol % to 40 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 5 mass % to 20 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

17. The resin composition according to claim 1 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 6 mol % to 45 mol % with respect to the total structural units, and the amount of a fluorine atom in the resin A is 1 mass % to 25 mass % with respect to the total mass of the resin A.

18. The resin composition according to claim 1 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 8 mol % to 40 mol % with respect to the total structural units, and the amount of a fluorine atom in the resin A is 5 mass % to 20 mass % with respect to the total mass of the resin A.

19. The resin composition according to claim 1 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 6 mol % to 45 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 1 mass % to 25 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

20. The resin composition according to claim 1 , wherein the amount of the sulfonic-acid-group-containing structural unit included in the resin A is 8 mol % to 40 mol % with respect to the total structural units, the amount of a fluorine atom in the resin A is 5 mass % to 20 mass % with respect to the total mass of the resin A, and the amount of a fluorine atom in the resin C with respect to a total mass of the resin C exceeds 40 mass %.

Assignees

• Jsr Corp

Inventors

• Sakurai Tomohiko
• Osawa Sosuke
• Nakashima Hiromitsu

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• G03F7/2041

  in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title

• C08L41/00 Primary

  Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur; Compositions of derivatives of such polymers · CPC title

• G03F7/38

  Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title

• G03F7/2004

  characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title