High critical temperature metal nitride layer with oxide or oxynitride seed layer

US11600761B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11600761-B2
Application numberUS-202117178187-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2021
Priority dateFeb 21, 2020
Publication dateMar 7, 2023
Grant dateMar 7, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A superconducting device includes a substrate, a metal oxide or metal oxynitride seed layer on the substrate, and a metal nitride superconductive layer disposed directly on the seed layer. The seed layer is an oxide or oxynitride of a first metal, and the superconductive layer is a nitride of a different second metal.

First claim

Opening claim text (preview).

What is claimed is: 1. A superconducting device, comprising: a substrate; a metal oxide or metal oxynitride seed layer on the substrate, the seed layer being an oxide or oxynitride of a first metal; a metal nitride superconductive layer disposed directly on the seed layer, the superconductive layer being a nitride of a different second metal; and a distributed Bragg reflector between the substrate and the metal oxide or metal oxynitride seed layer. 2. The device of claim 1 , wherein the nitride of the second metal is niobium nitride, titanium nitride, or niobium titanium nitride. 3. The device of claim 2 , wherein the metal nitride superconductive layer comprises δ-phase NbN. 4. The device of claim 2 , wherein the first metal is aluminum. 5. The device of claim 1 , where the metal oxide or metal oxynitride seed layer has a thickness less than 2 nm. 6. The device of claim 1 , wherein the metal oxide or metal oxynitride seed layer has a thickness of 3-50 nm. 7. The device of claim 1 , further comprising a capping layer on the superconductive layer. 8. A superconducting device, comprising: a substrate having a top surface; a metal oxide or metal oxynitride seed layer on the substrate, the seed layer being an oxide or oxynitride of a first metal; a metal nitride superconductive layer disposed directly on the seed layer, the superconductive layer being a nitride of a different second metal; and an optical waveguide between the substrate and the metal oxide or metal oxynitride seed layer to receive light propagating substantially parallel to the top surface of the substrate. 9. The device of claim 1 , wherein the metal nitride superconductive layer has a thickness of 4 to 50 nm. 10. A superconducting device, comprising: a substrate; a lower seed layer on the substrate, the lower seed layer being a nitride of a first metal; an upper seed layer disposed directly on the lower seed layer, the upper seed layer being an oxide or oxynitride of the first metal; and a superconductive layer disposed directly on the upper seed layer, the superconductive layer being a nitride of a different second metal. 11. The device of claim 10 , wherein the upper seed layer has a thickness of 0.1 to 1 nm. 12. The device of claim 11 , wherein the lower seed layer has a thickness of 3-50 nm. 13. The device of claim 10 , wherein the nitride of the second metal is niobium nitride, titanium nitride, or niobium titanium nitride. 14. The device of claim 13 , wherein the first metal is aluminum. 15. A superconducting device, comprising: a substrate; an aluminum nitride seed layer on the substrate; an aluminum oxide or aluminum oxynitride seed layer disposed directly on the aluminum nitride seed layer; and a superconductive layer disposed directly on the upper aluminum oxide or aluminum oxynitride seed layer, the superconductive layer being niobium nitride, titanium nitride, or niobium titanium nitride. 16. The device of claim 8 , wherein the second metal is niobium nitride, titanium nitride, or niobium titanium nitride. 17. The device of claim 16 , wherein the metal nitride superconductive layer comprises δ-phase NbN. 18. The device of claim 16 , wherein the first metal is aluminum. 19. The device of claim 8 , where the metal oxide or metal oxynitride seed layer has a thickness less than 2 nm. 20. The device of claim 8 , wherein the metal oxide or metal oxynitride seed layer has a thickness of 3-50 nm.

Assignees

Inventors

Classifications

  • Josephson-effect devices · CPC title

  • Switching means for devices switchable between superconducting and normal states · CPC title

  • of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) · CPC title

  • H10N60/85Primary

    Superconducting active materials · CPC title

  • of devices comprising nitrides or carbonitrides · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11600761B2 cover?
A superconducting device includes a substrate, a metal oxide or metal oxynitride seed layer on the substrate, and a metal nitride superconductive layer disposed directly on the seed layer. The seed layer is an oxide or oxynitride of a first metal, and the superconductive layer is a nitride of a different second metal.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10N60/85. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).