Device modified substrate article and methods for making
US-2017182744-A1 · Jun 29, 2017 · US
US11596072B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11596072-B2 |
| Application number | US-201916591002-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2019 |
| Priority date | Oct 28, 2016 |
| Publication date | Feb 28, 2023 |
| Grant date | Feb 28, 2023 |
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Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.
Opening claim text (preview).
The invention claimed is: 1. An electrical device, comprising: a softening polymer layer; an electrode layer on a surface of the softening polymer layer; and a cover layer composed of a second softening polymer on the surface of the softening polymer layer, wherein: a mechanical neutral plane of the device is located at or above the surface of the softening polymer layer, and an opening in the second softening polymer cover layer exposes a portion of a surface of the electrode layer, wherein the softening polymer layer and the cover layer of the second softening polymer are composed of a softening polymer having a Young's modulus that decreases by more than 1 order of magnitude within a 30° C. temperature increase. 2. The electrical device of claim 1 , wherein the cover layer has a Young's modulus that is within ±10 percent of a Young's modulus of the softening polymer layer. 3. The electrical device of claim 1 , wherein the cover layer has a thickness that is within ±10 percent of a thickness of the softening polymer layer. 4. The electrical device of claim 1 , wherein the within 30° C. temperature increase is from a lower temperature of 20° C. to a higher temperature of 50° C. 5. The electrical device of claim 1 , wherein the within 30° C. temperature increase is from a lower temperature of 20° C. to a higher temperature of 37° C.
for lift-off processes · CPC title
Solder materials or compositions specially adapted therefor · CPC title
Photoresists · CPC title
Screens or stencils; Holders therefor · CPC title
Pads for surface mounting, e.g. lay-out · CPC title
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