Sub-wavelength structural material having patch type array and compatibility of low detectability for infrared, laser, and microwave

US11592602B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11592602-B2
Application numberUS-201816652861-A
CountryUS
Kind codeB2
Filing dateJul 17, 2018
Priority dateDec 13, 2017
Publication dateFeb 28, 2023
Grant dateFeb 28, 2023

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present disclosure provides a sub-wavelength structural material having compatibility of low detectability for infrared, laser, and microwave, which includes, from top to bottom, a metal type frequency selective surface layer I, a dielectric layer I, a metal type frequency selective surface layer II, a dielectric layer II, a resistive film, a dielectric layer III. Each of the metal type frequency selective surface layers is a sub-wavelength patch type array, and metal used by the metal type frequency selective surface layers has a characteristic of low infrared emissivity. The present disclosure modulates a phase by using a phase difference generated by patches with different sizes on the metal type frequency selective surface layer I, so as to control backscattering of incident electromagnetic waves to achieve compatibility of low detectability for laser and infrared, while the bottom three layers achieve absorption of microwave.

First claim

Opening claim text (preview).

We claim: 1. A sub-wavelength structural material having compatibility of low detectability for infrared, laser, and microwave, comprising: a metal type frequency selective surface layer I, the metal type frequency selective surface layer I being a sub-wavelength patch type array; a dielectric layer I disposed below the metal type frequency selective surface layer I; a metal type frequency selective surface layer II disposed below the dielectric layer I, the metal type frequency selective surface layer II being also a sub-wavelength patch type array; a dielectric layer II disposed below the metal type frequency selective surface layer II; a resistive film layer disposed below the dielectric layer II; and a dielectric layer III disposed below the resistive film layer, wherein the metal type frequency selective surface layer I, the dielectric layer I and the metal type frequency selective surface layer II are used to realize low detectability for laser and infrared, and the dielectric layer II, the resistive film layer, the dielectric layer III, and a metal reflective plate are used to realize absorption of microwaves. 2. The sub-wavelength structural material according to claim 1 , wherein a thickness t 1 of the metal type frequency selective surface layer I is 0.05 μm to 0.1 μm; a thickness t 2 of the dielectric layer I is 1 μm to 2 μm; a thickness t 3 of the metal type frequency selective surface layer II is 0.08 μm to 0.15 μm; a thickness t 4 of the dielectric layer II is 1.6 mm to 3 mm; a thickness t 5 of the resistive film layer is 0.01 mm to 0.03 mm; and a thickness t 6 of the dielectric layer III is 1.2 mm to 2.8 mm. 3. The sub-wavelength structural material according to claim 1 , wherein a square resistance Rs of the resistive film layer is 20Ω/□ to 200Ω/□. 4. The sub-wavelength structural material according to claim 1 , wherein a dielectric constant Er 1 of the dielectric layer I is 1.5 to 3.5, and a dielectric loss tan δ 1 of the dielectric layer I is 0.001 to 0.03. 5. The sub-wavelength structural material according to claim 1 , wherein a dielectric constant Er 2 of the dielectric layer II is 2 to 6, and a dielectric loss tan δ 2 of the dielectric layer II is 0.001 to 0.09. 6. The sub-wavelength structural material according to claim 1 , wherein a dielectric constant Er 3 of the dielectric layer III is 2 to 8, and a dielectric loss tan δ 2 of the dielectric layer III is 0.001 to 0.09. 7. The sub-wavelength structural material according to claim 1 , wherein metal used by the metal type frequency selective surface layer I and the metal type frequency selective surface layer II has a characteristic of low infrared emissivity. 8. The sub-wavelength structural material according to claim 7 , wherein the metal having low infrared emissivity is gold, silver, aluminum, copper, or platinum. 9. The sub-wavelength structural material according to claim 7 , wherein the metal type frequency selective surface layer I has different patches having a reflection phase difference, so that effective scattering for incident infrared waves is realized by combining the different patches. 10. The sub-wavelength structural material according to claim 7 , wherein the metal type frequency selective surface layer II is used to provide reflection. 11. The sub-wavelength structural material according to claim 7 , wherein a periodic unit size p of the metal type frequency selective surface layer I having the patch type array is 2.6 μm to 4.8 μm, and a scale factor x 1 of the periodic unit p is 0.5 to 0.8, and a scale factor x 2 of the periodic unit p is 0.1 to 0.4. 12. The sub-wavelength structural material according to claim 7 , wherein a periodic unit size q of the metal type frequency selective surface layer II having the patch type array is 2.6 μm to 4.8 μm, and a scale factory of the periodic unit q is 0.9 to 0.98.

Assignees

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Classifications

  • Light absorbing elements · CPC title

  • said selective devices having a stacked geometry or having multiple layers · CPC title

  • Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems · CPC title

  • made of materials engineered to provide properties not available in nature, e.g. metamaterials · CPC title

  • G02B5/0215Primary

    the surface having a regular structure · CPC title

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What does patent US11592602B2 cover?
The present disclosure provides a sub-wavelength structural material having compatibility of low detectability for infrared, laser, and microwave, which includes, from top to bottom, a metal type frequency selective surface layer I, a dielectric layer I, a metal type frequency selective surface layer II, a dielectric layer II, a resistive film, a dielectric layer III. Each of the metal type fre…
Who is the assignee on this patent?
Inst Optics & Electronics Cas, The Inst Of Optics And Electronics Chinese Academy Of Sciences
What technology area does this patent fall under?
Primary CPC classification G02B5/0215. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 28 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).