Heat sink assembly for electronic equipment

Patent metadata

Field	Value
Publication number	US-11589481-B2
Application number	US-202016993885-A
Country	US
Kind code	B2
Filing date	Aug 14, 2020
Priority date	Aug 14, 2020
Publication date	Feb 21, 2023
Grant date	Feb 21, 2023

Abstract

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

First claim

What is claimed is:

1. An apparatus comprising:
a cage defining a chamber;
a heat sink to facilitate heat dissipation, the heat sink including a mating surface and a passageway extending through the heat sink;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to be positioned against a perimeter of the chamber; and
an actuation assembly including a shape memory alloy (SMA) element extending through the passageway, the SMA element configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material is disposed within or adjacent the perimeter of the chamber, and when the SMA element is moved to the second position, the second surface of the thermal interface material is moved a distance away from the perimeter of the chamber.

2. The apparatus of claim 1 , wherein the second surface of the thermal interface material is parallel to a top of the perimeter of the chamber when the SMA element is in the second position.

3. The apparatus of claim 2 , wherein the heat sink is moveable with one degree of freedom when the SMA element moves between the first position and the second position.

4. The apparatus of claim 2 , wherein the heat sink spans a front-to-back dimension of the chamber.

5. The apparatus of claim 1 , wherein the SMA element is a one-way SMA and the actuation assembly further comprises:
a biasing member configured to move the SMA element to the second position.

6. The apparatus of claim 1 , wherein the SMA element is a two-way SMA and is configured to move between the first position and the second position in response to different magnitudes of current or in response to current being delivered to different portions of the SMA element.

7. The apparatus of claim 1 , wherein the SMA element is a first SMA element and the actuation assembly further comprises:
a second SMA element, wherein the first SMA element is configured to deform to move to the first position and the second SMA element is configured to deform to drive movement of the first SMA element to the second position.

8. The apparatus of claim 7 , wherein the actuation assembly further comprises:
a bi-stable toggle that is configured to lock the thermal interface material in specific positions after the thermal interface material is moved by the first SMA element or the second SMA element.

9. The apparatus of claim 1 , further comprising:
at least one indicator that provides an indication of a position of the thermal interface material.

10. The apparatus of claim 1 , wherein the thermal interface material is configured to selectively engage a heat transfer surface of a field replaceable computing module installed in the chamber of the cage, such that the second surface of the thermal interface material contacts the heat transfer surface of the field replaceable computing module when the SMA element is in the first position and is spaced apart from the heat transfer surface of the field replaceable computing module when the SMA element is in the second position.

11. The apparatus of claim 1 , wherein the actuation assembly is configured to be actuated in response to solely electrical actuation.

12. The heat sink assembly of claim 11 , wherein the SMA element is directly connected to the heat sink within the passageway.

13. A heat sink assembly for a cage for a field replaceable computing module, comprising:
a heat sink to facilitate heat dissipation, the heat sink including a mating surface and a passageway extending through the heat sink;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to engage a heat transfer surface of the field replaceable computing module installed adjacent the heat sink; and
an actuation assembly including a shape memory alloy (SMA) element, the SMA element extending through the passageway, wherein when the SMA element is configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.

14. The heat sink assembly of claim 13 , wherein the second surface of the thermal interface material is parallel to the heat transfer surface of the field replaceable computing module when the SMA element is in the second position.

15. The heat sink assembly of claim 14 , wherein the heat sink is moveable along one degree of freedom when the SMA element moves between the first position and the second position.

16. The heat sink assembly of claim 13 , wherein the heat sink assembly further comprises:
closure brackets configured to enclose the SMA element within the passageway.

17. The heat sink assembly of claim 13 , wherein the SMA element is a one-way SMA and the actuation assembly further comprises:
a biasing member configured to move the SMA element to the second position.

18. A system comprising:
a cage defining a chamber configured to receive a field replaceable computing module with a heat transfer surface;
a heat sink to facilitate heat dissipation, the heat sink including a mating surface and a passageway extending through the heat sink;
a thermal interface material including a first surface and a second surface, the first surface being coupled to the mating surface of the heat sink and the second surface being opposite the first surface to selectively engage the heat transfer surface of the field replaceable computing module when the field replaceable computing module is installed in the chamber of the cage; and
an actuation assembly including a shape memory alloy (SMA) element extending through the passageway, wherein when the field replaceable computing module is configured to be installed in the chamber of the cage and configured to be moveable between a first position and a second position such that when the SMA element is in the first position, the second surface of the thermal interface material contacts the heat transfer surface of the field replaceable computing module, and when the SMA element moves to the second position, the second surface of the thermal interface material is moved a distance away from the heat transfer surface of the field replaceable computing module.

19. The system of claim 18 , further comprising:
circuitry configured to activate a light to provide an illuminated indication when the SMA element is in at least one of the first position or the second position.

20. The system of claim 18 , wherein the heat sink is moveable along one degree of freedom when the SMA element moves between the first position and the second position.

Assignees

• Cisco Tech Inc

Inventors

• Gupta Rohit Dev
• Twiss Robert Gregory

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K7/20709 Primary

  for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G06F1/20

  Cooling means · CPC title