Circuit board

Patent metadata

Field	Value
Publication number	US-11582872-B2
Application number	US-201916433594-A
Country	US
Kind code	B2
Filing date	Jun 6, 2019
Priority date	Apr 28, 2017
Publication date	Feb 14, 2023
Grant date	Feb 14, 2023

Abstract

A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.

First claim

What is claimed is:

1. A circuit board comprising:
a conductive wiring comprising:
a first conductive wiring layer; and
a second conductive wiring layer, wherein the first conductive wiring layer and the second conductive wiring layer are in direct contact to each other, a projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other, a cross-sectional shape of the second conductive wiring layer is trapezoidal;
a first cover film covering the first conductive wiring layer, the first cover film wrapping a top surface of the first conductive wiring layer away from the second conductive wiring layer and sidewalls of the first conductive wiring layer; and
a second cover film covering the second conductive wiring layer, the second cover film wrapping a top surface of the second conductive wiring layer away from the first conductive wiring layer and sidewalls of the second conductive wiring layer;
wherein the first cover film comprises a first cover layer and a first adhesive layer connected to the first cover layer, and the first adhesive layer is between the first cover layer and the first conductive wiring layer and wraps the top surface and the sidewalls of the first conductive wiring layer.

2. The circuit board of claim 1 , wherein the first cover film is made of liquid crystal polymer.

3. The circuit board of claim 1 , wherein the second cover film comprises a second cover layer and a second adhesive layer connected to the second cover layer, the second adhesive layer is positioned between the second cover layer and the second conductive wiring layer and wraps the top surface and the sidewalls of the second conductive wiring layer.

4. The circuit board of claim 1 , wherein the second cover film is made of liquid crystal polymer.

5. The circuit board of claim 1 , wherein the first conductive wiring layer has a thickness of 60 μm to 70 μm.

6. The circuit board of claim 1 , wherein a cross-sectional shape of the first conductive wiring layer is rectangular.

7. The circuit board of claim 1 , wherein the second conductive wiring layer has a thickness of 70 μm.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd

Inventors

• Wu ke-jian
• Xu Fang-Bo
• Wu Peng
• Shen jian-quan

Classifications

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• H05K2201/0141

  Liquid crystal polymer [LCP] · CPC title

• H05K3/12 Primary

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K3/064

  Photoresists · CPC title

• H05K3/205 Primary

  using a pattern electroplated or electroformed on a metallic carrier · CPC title