Soldering apparatus, computer-readable medium, and soldering method

Patent metadata

Field	Value
Publication number	US-11577334-B2
Application number	US-201816205942-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Nov 30, 2017
Publication date	Feb 14, 2023
Grant date	Feb 14, 2023

Abstract

Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.

First claim

What is claimed is:

1. A soldering apparatus comprising:
a motor configured to move a soldering iron relative to a system origin point; and
a computer configured to
receive gerber data including definitions of a plurality of physical features of a substrate, the definitions including substrate coordinates for each of the physical features relative to a substrate origin point on the substrate, the substrate origin point being different from the system origin point, the definitions further including identifiers for physical feature type,
receive, separately from the gerber data, system coordinates for the substrate origin point, the system coordinates for the substrate origin point being relative to the system origin point,
extract from the received gerber data, the substrate coordinates of at least one of the physical features,
receive, separately from the gerber data, information on a type of physical feature to be soldered,
compare the received information to the identifiers for physical feature type during the extracting of the substrate coordinates from the received gerber data, such that the extracted substrate coordinates are for physical features that are of a type that corresponds to the received information,
use the extracted substrate coordinates to derive system coordinates for the at least one of the physical features of the substrate, the system coordinates for the at least one of the physical features being relative to the system origin point, and
control the motor according to at least some of the derived system coordinates in order to perform a soldering process on the substrate.

2. The soldering apparatus of claim 1 , wherein the received information on a type of physical feature indicates a shape of the physical feature.

3. The soldering apparatus of claim 2 , wherein
the system coordinates for the substrate origin point are three-dimensional coordinates,
the extracted substrate coordinates, of the at least one of the physical features, are two-dimensional coordinates,
the computer is configured to use the two-dimensional coordinates to derive the system coordinates for the at least one of the physical features, the derived system coordinates being three-dimensional coordinates, and
the controlling of the motor by the computer is performed according to the derived three-dimensional coordinates in order to perform the soldering process on the substrate.

4. The soldering apparatus of claim 1 , wherein
the system coordinates for the substrate origin point are three-dimensional coordinates,
the extracted substrate coordinates, of the at least one of the physical features, are two-dimensional coordinates,
the computer is configured to use the two-dimensional coordinates to derive the system coordinates for the at least one of the physical features, the derived system coordinates being three-dimensional coordinates, and
the controlling of the motor by the computer is performed according to the derived three-dimensional coordinates in order to perform the soldering process on the substrate.

5. The soldering apparatus of claim 1 , wherein the computer is configured to
receive user selection input for selecting soldering targets, and
use the received user selection input to select, from among the derived system coordinates, a subset of the derived system coordinates,
wherein the controlling of the motor by the computer is performed according to the selected subset of the derived system coordinates, instead of according to all the derived system coordinates, in order to perform the soldering process on the substrate.

6. The soldering apparatus of claim 5 , wherein the computer is configured to
receive user editing input for editing coordinates, and
use the received user editing input to generate changed system coordinates from the derived system coordinates,
wherein the controlling of the motor by the computer is performed at least according to the changed system coordinates in order to perform the soldering process on the substrate.

7. The soldering apparatus of claim 5 , wherein
the computer is configured to receive inversion information representing an orientation of the substrate relative to the soldering apparatus, the orientation being that of the substrate having been turned over about a first axis of the soldering apparatus,
the computer uses the extracted substrate coordinates and the inversion information to derive the system coordinates for the at least one of the physical features of the substrate, and
according to the inversion information, the computer inverts a positive/negative sign of a value in the extracted substrate coordinates in order to derive the system coordinates for the at least one of the physical features of the substrate, and the value is along a second axis orthogonal to the first axis.

8. The soldering apparatus of claim 7 , wherein the computer is configured to
receive user editing input for editing coordinates, and
use the received user editing input to generate changed system coordinates from the derived system coordinates,
wherein the controlling of the motor by the computer is performed at least according to the changed system coordinates in order to perform the soldering process on the substrate.

9. The soldering apparatus of claim 1 , wherein
the computer is configured to receive inversion information representing an orientation of the substrate relative to the soldering apparatus, the orientation being that of the substrate having been turned over about a first axis of the soldering apparatus,
the computer uses the extracted substrate coordinates and the inversion information to derive the system coordinates for the at least one of the physical features of the substrate, and
according to the inversion information, the computer inverts a positive/negative sign of a value in the extracted substrate coordinates in order to derive the system coordinates for the at least one of the physical features of the substrate, and the value is along a second axis orthogonal to the first axis.

10. The soldering apparatus of claim 1 , wherein
the system coordinates for the substrate origin point are three-dimensional coordinates,
the extracted substrate coordinates, of the at least one of the physical features, are two-dimensional coordinates,
the computer is configured to use the two-dimensional coordinates to derive the system coordinates for the at least one of the physical features, the derived system coordinates being three-dimensional coordinates, and
the controlling of the motor by the computer is performed according to the derived three-dimensional coordinates in order to perform the soldering process on the substrate.

11. A non-transitory computer-readable medium storing instructions which, when executed by a computer of a soldering apparatus having a motor configured to move a soldering iron relative to a system origin point, cause the computer to perform a soldering method comprising:
receiving gerber data including definitions of a plurality of physical features of a substrate, the definitions including substrate coordinates for each of the physical features relative to a substrate origin point on the substrate, the substrate origin point being different from the system origin point, the definitions further including identifiers for physical feature type;
receiving, separately from the gerber data, system coordinates for the substrate origin point, the system coordinates for the substrate origin point being relative to the system origin point;
extracting from the received gerber data, the substrate coordinates of at least one of the physical features of the substrate;
receiving, separately from the ge

Assignees

• Hakko Corp

Inventors

• Teraoka Yoshitomo
• Manda Satoshi
• Takahara Tomoo

Classifications

• G06F30/39

  Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) · CPC title

• B23K3/0607

  Solder feeding devices · CPC title

• B23K3/087 Primary

  Soldering or brazing jigs, fixtures or clamping means · CPC title

• H05K3/34

  by soldering · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title