Fabric-mounted components

Patent metadata

Field	Value
Publication number	US-11576262-B2
Application number	US-202117212983-A
Country	US
Kind code	B2
Filing date	Mar 25, 2021
Priority date	Apr 27, 2020
Publication date	Feb 7, 2023
Grant date	Feb 7, 2023

Abstract

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

First claim

What is claimed is:

1. An item, comprising:
strands that are interlaced to form fabric and that include a conductive strand; and
an electrical component mounted to the fabric, wherein the electrical component comprises:
a substrate having a contact pad;
an electrical device mounted to the substrate;
a protective structure that encapsulates the electrical device; and
an interconnect structure that passes through the protective structure and that electrically couples the conductive strand to the contact pad on the substrate.

2. The item defined in claim 1 wherein the substrate comprises printed circuit layers.

3. The item defined in claim 1 wherein the interconnect structure has a recessed upper surface and wherein the conductive strand is soldered to the recessed upper surface.

4. The item defined in claim 1 wherein the protective structure is molded around the interconnect structure.

5. The item defined in claim 4 wherein the protective structure comprises thermoplastic.

6. The item defined in claim 4 wherein the electrical device comprises an optical device and the protective structure comprises an opening through which light is transmitted.

7. The item defined in claim 4 wherein the electrical device comprises an optical device and the protective structure comprises transparent plastic.

8. The item defined in claim 1 wherein the electrical device comprises an optical device overlapped by a lens, the electrical component further comprising a grommet surrounding the lens that secures the fabric relative to the lens.

9. The item defined in claim 1 wherein the interconnect structure is selected from the group consisting of: printed circuit layers and a metal via.

10. The item defined in claim 1 further comprising an additional electrical component stacked with the electrical component, wherein the protective structure is interposed between the electrical component and the additional electrical component.

11. An electronic component mounted to fabric having a conductive strand, the electronic component comprising:
a printed circuit substrate having a surface with a contact pad;
an electrical device mounted to the printed circuit substrate;
a protective structure that encapsulates the electrical device, wherein the protective structure has an opening; and
a conductive structure coupled to the contact pad and located in the opening, wherein the conductive strand is located at least partially in the opening and is electrically coupled to the contact pad through the conductive structure.

12. The electronic component defined in claim 11 wherein the conductive structure comprises a U-shaped metal structure coupled to the contact pad and having first and second side wall surfaces that line the opening and are perpendicular to the surface.

13. The electronic component defined in claim 11 wherein the conductive structure comprises a U-shaped metal structure coupled to the contact pad and having first and second side wall surfaces that line the opening and are parallel to the surface.

14. The electronic component defined in claim 11 further comprising solder that couples the conductive strand to the conductive structure.

15. The electronic component defined in claim 11 wherein the protective structure comprises thermoplastic.

16. An electronic component mounted to fabric having a conductive strand, the electronic component comprising:
first printed circuit layers having opposing first and second surfaces and a contact pad, wherein the conductive strand is electrically coupled to the contact pad;
an electrical device mounted to the first surface;
second printed circuit layers located on the first surface that at least partially surround the electrical device; and
third printed circuit layers located on the second printed circuit layers such that the electrical device and the conductive strand are interposed between the third printed circuit layers and the first printed circuit layers.

17. The electronic component defined in claim 16 further comprising encapsulant material that encapsulates the electrical device.

18. The electronic component defined in claim 16 wherein the third printed circuit layers include third and fourth opposing surfaces and wherein the third surface is attached to the second printed circuit layers and the fourth surface has an additional contact pad.

19. The electronic component defined in claim 17 wherein the electrical device is located in a gap in the second printed circuit layers and wherein the encapsulant material fills the gap.

20. The electronic component defined in claim 16 further comprising:
solder that forms a solder connection between the conductive strand and the contact pad; and
encapsulant material that encapsulates the solder connection.

Assignees

• Apple Inc

Inventors

• Ibrahim Kani Bilal Mohamed
• Grena Benjamin J
• Kim Kyusang
• Kindlon David M
• Lupo Pierpaolo
• Renjan Kishore N
• Vadeentavida Manoj

Classifications

• H10W70/655

  Fan-out layouts · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title