Infrared image sensor and infrared camera module

Patent metadata

Field	Value
Publication number	US-11575845-B2
Application number	US-202117341889-A
Country	US
Kind code	B2
Filing date	Jun 8, 2021
Priority date	Oct 26, 2020
Publication date	Feb 7, 2023
Grant date	Feb 7, 2023

Abstract

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

First claim

What is claimed is:

1. An infrared image sensor comprising:
a first integrated circuit (IC);
a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module;
a via electrically connecting the first IC and the bolometer; and
a reflective layer disposed between the first IC and the bolometer,
wherein the first IC comprises:
at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information; and
at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

2. The infrared image sensor of claim 1 , further comprising a second IC disposed on an other surface of the first IC opposite the one surface of the first IC,
wherein the second IC comprises at least a portion of the ISP element, and is configured to output the infrared image information outside the second IC, and
wherein the first IC is configured to output a value corresponding to a distance by which the lens module is to move, outside the first IC.

3. The infrared image sensor of claim 1 , wherein the first IC comprises the RO element and the ISP element, and
wherein the ISP element is configured to convert and digitally process the infrared sensing information into a digital value.

4. The infrared image sensor of claim 1 , wherein the first IC comprises the ISP element, is configured to output the infrared image information outside the first IC, and is configured to output a value corresponding to a distance by which the lens module is to move, outside the first IC.

5. The infrared image sensor of claim 4 , wherein the ISP element is configured to extract at least one of position information and acceleration information of the lens module, based on at least one of the infrared sensing information and the infrared image information, and
wherein at least one of the AF control element and the OIS control element is configured to generate a value corresponding to a distance by which the lens module is to move, based on the at least one of the position information and the acceleration information.

6. The infrared image sensor of claim 1 , wherein at least one of the AF control element and the OIS control element is configured to receive a detection result from at least one of a position sensor and an acceleration sensor, and output a value corresponding to a distance by which the lens module is to move, based on the detection result from the at least one of the position sensor and the acceleration sensor, outside the first IC.

7. The infrared image sensor of claim 1 , wherein the first IC comprises the AF control element and the OIS control element.

8. An infrared camera module comprising:
the infrared image sensor of claim 1 ;
a lens module arranged to transmit infrared rays directed to the infrared image sensor;
a sensor disposed to detect at least one of a position or acceleration of the lens module and configured to provide a detection result to the infrared image sensor; and
a driver configured to drive the lens module to control at least one of the position or acceleration of the lens module, based on a value corresponding to a distance by which the lens module is to move, based on at least one of an autofocusing (AF) control element of the infrared image sensor and an optical image stabilization (OIS) control element of the infrared image sensor.

9. An infrared image sensor comprising:
a first IC and a second IC, stacked on each other;
a bolometer disposed on or above one surface of one of the first and second ICs configured to detect infrared rays passing through a lens module;
a via electrically connecting one of the first and second ICs to the bolometer; and
a reflective layer disposed between the bolometer and one of the first and second ICs,
wherein the first IC comprises at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and
wherein the second IC comprises at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

10. The infrared image sensor of claim 9 , wherein the second IC comprises at least a portion of the ISP element,
wherein the first IC is configured to transfer a remaining portion of the ISP element or a processing result of the RO element to the second IC, and
wherein the second IC is configured to output the infrared image information outside the second IC, and configured to output a value corresponding to a distance by which the lens module is to move, outside the second IC.

11. The infrared image sensor of claim 9 , wherein the first IC comprises the RO element and the ISP element,
wherein the ISP element is configured to convert and digitally process the infrared sensing information into a digital value,
wherein the first IC is configured to output the infrared image information outside the first IC, and
wherein the second IC is configured to output a value corresponding to a distance by which the lens module is to move, outside the second IC.

12. The infrared image sensor of claim 9 , further comprising a third IC stacked on one of the first and second ICs or stacked between the first and second ICs,
wherein the third IC comprises at least a portion of the ISP element, and is configured to output the infrared image information outside the third IC.

13. The infrared image sensor of claim 9 , wherein the first IC comprises the ISP element,
wherein the ISP element is configured to extract at least one of position information and acceleration information of the lens module, based on at least one of the infrared sensing information and the infrared image information, and
wherein at least one of the AF control element and the OIS control element is configured to output a value corresponding to a distance by which the lens module is to move, based on the at least one of the position information and the acceleration information, outside the second IC.

14. The infrared image sensor of claim 9 , wherein at least one of the AF control element and the OIS control element is configured to receive a detection result from at least one of a position sensor and an acceleration sensor, and is configured to output a value corresponding to a distance by which the lens module is to move, based on the detection result from the at least one of the position sensor and the acceleration sensor, outside the second IC.

15. The infrared image sensor of claim 9 , wherein the second IC comprises the AF control element and the OIS control element.

16. The infrared image sensor of claim 9 , wherein the first IC and the second IC are electrically connected to each other through a conductive pad or a through-silicon-via (TSV) disposed therebetween.

17. An infrared camera module comprising:
the infrared image sensor of claim 9 ;
a lens module arranged to transmit infrared rays directed to the infrared image sensor;
a sensor disposed to detect at least one of a position or acceleration of the lens module and config

Assignees

• Samsung Electro Mech

Inventors

• Park Jung Eui
• Kim Do Hwan
• Kim Seo Hyung

Classifications

• G01J5/0806 Primary

  Focusing or collimating elements, e.g. lenses or concave mirrors · CPC title

• H04N23/23

  from thermal infrared radiation · CPC title

• H10F30/10

  the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/8023

  Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery · CPC title