3D stacked uncooled IR sensor device and method

Patent metadata

Field	Value
Publication number	US-8975583-B2
Application number	US-201213415203-A
Country	US
Kind code	B2
Filing date	Mar 8, 2012
Priority date	Mar 8, 2012
Publication date	Mar 10, 2015
Grant date	Mar 10, 2015

Abstract

A 3D wafer-integration uncooled infrared (IR) microbolometer focal plane array (FPA) sensor includes a first die with an FPA of uncooled IR microbolometers, a second die signal-processing layer. The dies are vertically aligned, stacked with 3D wafer bonding, and interconnected. Interconnection include vertical electrical interconnects. Separate optimized manufacturing processes are used for die, so that additional processing costs of the FPA die are leveraged and 3D integration is completed at wafer level, minimizing total device cost and maximizing die count per wafer.

First claim

What is claimed is:

1. A wafer-integration uncooled infrared (IR) microbolometer focal plane array (FPA) sensor device comprising:
at least a first layer comprising at least one FPA of uncooled IR microbolometers, said at least a first layer comprises at least a portion of a read out integrated circuit (ROIC);
at least a second layer comprising a least one signal processing circuit, said at least a second layer comprises at least a portion of an ROIC;
wherein said at least a f…

Assignees

• Tinkler Rosanne H
• Blackwell Jr Richard J
• Bae Sys Inf & Elect Sys Integ

Inventors

• Tinkler Rosanne H
• Blackwell Jr Richard J

Classifications

• G01J5/045

  Physics · mapped topic

• G01J5/024

  Physics · mapped topic

• H04N23/57

  Electricity · mapped topic

• G01J5/0884

  Physics · mapped topic

• G01J5/20 Primary

  Physics · mapped topic