Microchip charge patterning

Patent metadata

Field	Value
Publication number	US-11574876-B2
Application number	US-201816008961-A
Country	US
Kind code	B2
Filing date	Jun 14, 2018
Priority date	Oct 15, 2012
Publication date	Feb 7, 2023
Grant date	Feb 7, 2023

Abstract

A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.

First claim

What is claimed is:

1. A method of forming a charge pattern on a microchip, comprising:
depositing a first film of a first polymer on an insulator surface of the microchip and photolithographically defining the first film to expose a portion of the insulator surface;
depositing a second film of a second polymer at least partially on the first film;
photolithographically patterning the second polymer to define a region separate from the portion of the first region, wherein the first polymer and the second polymer retain one of either different charges or different magnitudes of a same charge to form the charge pattern; and
immersing the microchip in a non-polar fluid comprising one selected from the group consisting of: an isoparafinnic liquid, a hydrocarbon liquid and dodecane.

2. The method as claimed in claim 1 , wherein depositing the first polymer comprises depositing one of an anionic polyelectrolyte, cationic polyelectrolyte, a non-ionic polymer, polystyrenesulfonic acid, poly(diallyldimethylammonium chloride), polyethylene, or polyvinylalcohol.

3. The method as claimed in claim 1 , wherein the non-polar fluid includes charge control agents comprise one of ionic amphiphilic surfactant materials, non-ionic amphiphilic surfactant materials, lecithin, span-80, ALOHOS, OLOA, or AOT.

4. The method of claim 1 , wherein depositing the material comprises one of spin-coating, printing, dip-coating, self-assembly, or vapor deposition.

5. The method as claimed in claim 1 , further comprising singulating the wafer into microchips.

Assignees

• Palo Alto Res Ct Inc

Inventors

• Chow Eugene M
• Lu Jenping
• Volkel Armin R
• Hsieh Bing R
• Whiting Gregory L
• Doris Sean E

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W46/401

  for identification or tracking · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title