Electrical connection device, method for producing the same, and structure of flexible wiring board

Patent metadata

Field	Value
Publication number	US-11570893-B2
Application number	US-202217736482-A
Country	US
Kind code	B2
Filing date	May 4, 2022
Priority date	Mar 6, 2020
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

First claim

What is claimed is:

1. A method for producing an electrical connection device that includes:
a flexible base;
an adhesive layer on the flexible base, the adhesive layer containing a pressure sensitive adhesive and having a predetermined longitudinal elastic modulus;
an elastomer pattern on the adhesive layer, the elastomer pattern having a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the adhesive layer; and
a conductor pattern on the elastomer pattern,
the method comprising:
printing on a blanket the conductive pattern using ink containing conductive particles;
thermally curing the conductive pattern;
printing on the conductive pattern the elastomer pattern using ink containing an elastomer composition;
thermally curing the elastomer pattern to have the predetermined longitudinal elastic modulus; and
transferring together the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer having the predetermined longitudinal elastic modulus, in such a way as to make the elastomer pattern locate on the adhesive layer.

2. A method for producing an electrical connection device that includes:
a flexible base;
an adhesive layer on the flexible base, the adhesive layer containing a pressure sensitive adhesive and having a predetermined longitudinal elastic modulus;
an elastomer pattern on the adhesive layer, the elastomer pattern having a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the adhesive layer; and
a conductor pattern on the elastomer pattern,
the method comprising:
printing on a blanket the conductive pattern using ink containing conductive particles;
printing on the conductive pattern the elastomer pattern using ink containing an elastomer composition;
thermally curing together the conductor pattern and the elastomer pattern, thereby achieving the predetermined longitudinal elastic modulus of the elastomer pattern; and
transferring together the conductor pattern and the elastomer pattern from the blanket onto the adhesive layer having the predetermined longitudinal elastic modulus, in such a way as to make the elastomer pattern locate on the adhesive layer.

3. A wiring structure of a flexible wiring board comprising:
a first layer structure including a first flexible base, a first adhesive layer, an elastomer pattern, and a conductor pattern; and
a second layer structure adhering to the first layer structure, the second layer structure including a second flexible base, a second adhesive layer, and an elastomer layer,
wherein
the first adhesive layer is located on the first flexible base and contains a first pressure sensitive adhesive;
the elastomer pattern is located on the first adhesive layer and is made of a cured ink containing a first elastomer composition;
the conductor pattern is located on the elastomer pattern and is made of a cured ink containing conductive particles;
the second adhesive layer is located on the second flexible base and contains a second pressure sensitive adhesive,
the elastomer layer is located on the second adhesive layer and is made of a cured ink containing a second elastomer composition,
the first adhesive layer has an adhesive plane as part thereof that the elastomer pattern and the conductor pattern are not located on,
the elastomer layer adheres to the adhesive plane of the first adhesive layer to make the second layer structure adhere to the first layer structure,
the first adhesive layer has a predetermined longitudinal elastic modulus,
the second adhesive layer has a predetermined longitudinal elastic modulus
the elastomer pattern has a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the first adhesive layer, and
the elastomer layer has a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the second adhesive layer.

4. A wiring structure of a flexible wiring board comprising:
a first layer structure including a first flexible base, a first adhesive layer, a first elastomer pattern, and a first conductor pattern; and
a second layer structure adhering to the first layer structure, the second layer structure including a second flexible base, a second adhesive layer, a second elastomer layer, and a second conductor pattern,
wherein
the first adhesive layer is located on the first flexible base and contains a first pressure sensitive adhesive,
the first elastomer pattern is located on the first adhesive layer and is made of a cured ink containing a first elastomer composition;
the first conductor pattern is located on the first elastomer pattern and is made of a cured ink containing first conductive particles;
the second adhesive layer is located on the second flexible base and contains a second pressure sensitive adhesive,
the second elastomer pattern is located on the second adhesive layer and is made of a cured ink containing a second elastomer composition,
the second conductor pattern is located on the second elastomer pattern and is made of a cured ink containing second conductive particles,
the first adhesive layer has an adhesive plane as part thereof that the first elastomer pattern and the first conductor pattern are not located on,
the second adhesive layer has an adhesive plane as part thereof that the second elastomer pattern and the second conductor pattern are not located on,
the adhesive plane of the first adhesive layer and the adhesive plane of the second adhesive layer adheres to each other to make the first layer structure and the second layer structure adhere to each other,
the first adhesive layer has a predetermined longitudinal elastic modulus,
the second adhesive layer has a predetermined longitudinal elastic modulus,
the first elastomer pattern has a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the first adhesive layer, and
the second elastomer layer has a predetermined longitudinal elastic modulus larger than the predetermined longitudinal elastic modulus of the second adhesive layer.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Sato Junya
• Mitsui Ryosuke
• Yamabayashi Yoshiaki
• Tanaka Atsushi

Classifications

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K1/092 Primary

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title