System-level camera module with electrical support and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11570336-B2
Application number	US-202117242211-A
Country	US
Kind code	B2
Filing date	Apr 27, 2021
Priority date	Nov 13, 2015
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

First claim

What is claimed is:

1. A camera module, comprising:
an optical lens;
a photosensitive sensor, wherein said optical lens is positioned along a photosensitive path of said photosensitive sensor; and
an electrical support, which comprises:
a support body that supports said optical lens, having a first top surface and a second top surface at a level higher than said first top surface, wherein said first top surface and said second top surface are arranged at same top side of said support body;
a circuit arrangement embedded in said support body and conductively connected with said photosensitive sensor; and
a connecting member comprising a plurality of photosensitive sensor conductive members formed on a surface of said support body and electrically connected with said circuit arrangement;

wherein a plurality of electric component conductive members are formed on said first top surface of said support body and a plurality of driver conductive members are formed on said second top surface of said support body.

2. The camera module, as recited in claim 1 , wherein said photosensitive sensor is coupled with said support body and electrically connected to said photosensitive sensor conductive members to electrically connect with said circuit arrangement.

3. The camera module, as recited in claim 1 , wherein said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor.

4. The camera module, as recited in claim 2 , wherein said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor.

5. The camera module, as recited in claim 1 , further comprising a PCB, wherein said connecting member further comprises a plurality of PCB conductive members formed on said surface of said support body and electrically connected to said PCB, so as to electrically connect said PCB with said circuit arrangement.

6. The camera module, as recited in claim 4 , further comprising a PCB, wherein said connecting member further comprises a plurality of PCB conductive members formed on said surface of said support body and electrically connected to said PCB, so as to electrically connect said PCB with said circuit arrangement.

7. The camera module, as recited in claim 5 , further comprising a driver coupling with said optical lens, wherein said connecting member further comprises a plurality of driver conductive members formed on said surface of said support body and electrically connected to said driver, so as to electrically connect said driver with said circuit arrangement.

8. The camera module, as recited in claim 1 , wherein the plurality of electric component conductive members are electrically connected to a plurality of electric components with said circuit arrangement.

9. The camera module, as recited in claim 1 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrical support respectively.

10. The camera module, as recited in claim 4 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrically support respectively.

11. The camera module, as recited in claim 9 , wherein said support body has a top recess, a bottom recess, and a through hole extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed at said top recess and said bottom recess respectively.

12. The camera module, as recited in claim 1 , wherein said first top surface and said second top surface of said support body forms a step-down stair configuration.

13. The camera module, as recited in claim 1 , wherein said support body further has a first bottom surface and a second bottom surface at a level lower than said first bottom surface to form a step-down stair configuration, wherein said photosensitive sensor conductive members are formed on said first bottom surface, and flexible PCB conductive members are formed on said second bottom surface.

14. A method of manufacturing of a camera module, comprising the steps of:
(a) forming an electrical support by the steps of:
(a.1) embedding a circuit arrangement in a support body which has a first top surface and a second top surface arranged at same top side of said support body, wherein said circuit arrangement comprises a plurality of electrical conductors and a plurality of electronic elements which are pre-connected with said electrical conductors in an electrically connecting manner; and
(a.2) forming a plurality of photosensitive sensor conductive members on a surface of said support body and electrically connecting said photosensitive sensor conductive members with said circuit arrangement; and
(b) supporting a photosensitive sensor at said support body and electrically connecting said photosensitive sensor to said photosensitive sensor conductive members, such that said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor; and
(c) supporting an optical lens along a photosensitive path of said photosensitive sensor;

wherein a plurality of electric component conductive members are formed on said first top surface of said support body and a plurality of driver conductive members are formed on said second top surface of said support body.

15. The method, as recited in claim 14 , wherein said second top surface of said support body is provided at a level higher than said first top surface, wherein the step (a) further comprises a step of forming a plurality of PCB conductive members on said surface of said support body and electrically connecting said PCB conductive members with said circuit arrangement, and that, before the step (c), the method further comprises a step of providing a PCB which is electrically connected to said PCB conductive members so as to electrically connect said PCB with said circuit arrangement.

16. The method, as recited in claim 14 , wherein the step (d) further comprises a step of providing a driver that couples with said optical lens, wherein the step (a) further comprises a step of forming the plurality of driver conductive members on said second top surface of said support body and electrically connecting said driver conductive members to said driver, so as to electrically connect said driver with said circuit arrangement.

17. The method, as recited in claim 14 , further comprising a step of supporting an optical filter at a top side of said electrical support while said photosensitive sensor is installed at a bottom side of said electrical support which has a through hole extended through said top and bottom sides.

18. The method, as recited in claim 17 , wherein said electrical support has a top recess on said top side and a bottom recess on said bottom side thereof and said through hole is extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed in said top recess and said bottom recess respectively.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Chen Feifan
• Ding Liang
• Guo Nan
• Wu Ye
• Jiang Heng

Classifications

• H01L27/14618

  Electricity · mapped topic

• H04N5/2252

  Electricity · mapped topic

• H04N5/2253 Primary

  Electricity · mapped topic

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title