System-level camera module with electrical support and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11025805-B2
Application number	US-201916458164-A
Country	US
Kind code	B2
Filing date	Jun 30, 2019
Priority date	Nov 13, 2015
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

First claim

What is claimed is:

1. A camera module, comprising:
an optical lens;
a photosensitive sensor, wherein said optical lens is positioned along a photosensitive path of said photosensitive sensor, wherein said photosensitive sensor comprises a photosensitive sensor body and a plurality of photosensitive sensor conductive elements on a top surface of said photosensitive sensor body; and
an electrical support, which comprises:
a support body, which supports said optical lens, having a first top surface and a second top surface at a level higher than said first top surface to form a step-down stair configuration, wherein said first top surface and said second top surface are arranged at same top side of said support body; and
a circuit arrangement which comprises a plurality of electrical conductors and a plurality of electronic elements which are electrically connected to each other, integrally embedded in said support body to allow said support body to integrally encapsulate said plurality of electronic elements, and conductively connected with said photosensitive sensor;
a connecting member comprising a plurality of photosensitive sensor conductive members formed on a surface of said support body and electrically connected with said circuit arrangement, wherein said photosensitive sensor is coupled with said support body and said plurality of photosensitive sensor conductive elements is respectively electrically connected to said plurality of photosensitive sensor conductive members to electrically connect with said circuit arrangement; and
a plurality of electric component conductive members formed on said first top surface of said support body of said electrical support and electrically connected with said circuit arrangement, whereby said electrical support forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor and said optical lens.

2. The camera module, as recited in claim 1 , further comprising a driver coupling with said optical lens, wherein said optical lens, which is mounted on said driver, is capable of being driven by said driver for automatically focusing, wherein said connecting member further comprises a plurality of driver conductive members formed on said second top surface of said support body of said electrical support and electrically connected to said driver, so as to electrically connect said driver with said circuit arrangement.

3. The camera module, as recited in claim 1 , further comprising a PCB, wherein said connecting member further comprises a plurality of PCB conductive members formed on said surface of said support body and electrically connected to said PCB, so as to electrically connect said PCB with said circuit arrangement.

4. The camera module, as recited in claim 2 , further comprising a PCB, wherein said connecting member further comprises a plurality of PCB conductive members formed on said surface of said support body and electrically connected to said PCB, so as to electrically connect said PCB with said circuit arrangement.

5. The camera module, as recited in claim 3 , wherein said support body further has a first bottom surface and a second bottom surface at a level lower than said first bottom surface to form a step-down stair configuration, wherein said photosensitive sensor conductive members are formed on said first bottom surface and said PCB conductive members are formed on said second bottom surface.

6. The camera module, as recited in claim 4 , wherein said support body further has a first bottom surface and a second bottom surface at a level lower than said first bottom surface to form a step-down stair configuration, wherein said photosensitive sensor conductive members are formed on said first bottom surface and said PCB conductive members are formed on said second bottom surface.

7. The camera module, as recited in claim 1 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrical support respectively.

8. The camera module, as recited in claim 2 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrical support respectively.

9. The camera module, as recited in claim 5 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrical support respectively.

10. The camera module, as recited in claim 6 , further comprising an optical filter, wherein said optical filter and said photosensitive sensor are installed at two opposing sides of said electrical support respectively.

11. The camera module, as recited in claim 7 , wherein said support body has a top recess, a bottom recess, and a through hole extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed at said top recess and said bottom recess respectively.

12. The camera module, as recited in claim 8 , wherein said support body has a top recess, a bottom recess, and a through hole extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed at said top recess and said bottom recess respectively.

13. The camera module, as recited in claim 9 , wherein said support body has a top recess, a bottom recess, and a through hole extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed at said top recess and said bottom recess respectively.

14. The camera module, as recited in claim 10 , wherein said support body has a top recess, a bottom recess, and a through hole extended through said top recess and said bottom recess, wherein said optical filter and said photosensitive sensor are installed at said top recess and said bottom recess respectively.

15. A method of manufacturing of a camera module, comprising the steps of:
(a) forming an electrical support by the steps of:
(a.1) integrally embedding a circuit arrangement in a support body to form an integral structure, wherein said support body has a first top surface and a second top surface at a level higher than said first top surface to form a step-down configuration, wherein said first top surface and said second top surface are arranged at same top side of said support body, wherein said circuit arrangement comprises a plurality of electrical conductors and a plurality of electronic elements which are pre-connected with said electrical conductors in an electrically connecting manner, wherein said support body integrally encapsulate said plurality of electronic elements;
(a.2) forming a plurality of photosensitive sensor conductive members on a surface of said support body and electrically connecting said photosensitive sensor conductive members with said circuit arrangement;
(a.3) forming a plurality of electric component conductive members on said first top surface of said support body and electrically connected with said circuit arrangement; and
(a.4) forming a plurality of driver conductive members on said second top surface of said support body;
(b) supporting a photosensitive sensor at said support body and electrically connecting a plurality of photosensitive sensor conductive elements on a top surface of a photosensitive sensor body of a photosensitive sensor to said photosensitive sensor conductive members respectively, such that said support body forms a circuit board to electrically connect with said ph

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Chen Feifan
• Ding Liang
• Guo Nan
• Wu Ye
• Jiang Heng

Classifications

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/50 Primary

  Constructional details · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title