Apparatus for transporting substrate and system for treating substrate with the apparatus

Patent metadata

Field	Value
Publication number	US-11569103-B2
Application number	US-202117148914-A
Country	US
Kind code	B2
Filing date	Jan 14, 2021
Priority date	Jan 15, 2020
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

Provided are a substrate transporting apparatus capable of preventing an increase in temperature of a transporting robot by installing a cooling plate around the transporting robot, and a substrate treating system including the same. The substrate transporting apparatus includes a transporting unit for transporting a substrate; and a cooling plate for controlling a temperature of the transporting unit, wherein the cooling plate is spaced apart from a side surface of the transporting unit and installed as a side wall, or is installed in close contact with the side surface of the transporting unit.

First claim

What is claimed is:

1. An apparatus for transporting a substrate comprising:
a transporting unit for transporting a substrate;
a guide rail for providing a moving path of the transporting unit;
a support block coupled to an upper portion of the guide rail to support a lower surface the transporting unit, and sliding along the guide rail; and
a cooling plate for controlling a temperature of the transporting unit,
wherein the cooling plate is aligned facing a side surface of the transporting unit and installed as a side wall extending along the guide rail, the side surface of the transporting unit including one of a plurality of protrusions and a plurality of grooves, the cooling plate including another one of the plurality of protrusions and the plurality of grooves, wherein the transporting unit is in movable contact with the cooling plate with the plurality of protrusions inserted into respective ones of the plurality of grooves.

2. The apparatus for transporting a substrate of claim 1 ,
wherein a flow path, through which coolant flows, is installed inside the cooling plate.

3. The apparatus for transporting a substrate of claim 2 ,
wherein the coolant is PCW.

4. The apparatus for transporting a substrate of claim 1 ,
wherein the cooling plate comprises,
a first plate member;
a second plate member coupled to the first plate member; and
a flow path formed in a space between the first plate member and the second plate member, through which coolant flows.

5. The apparatus for transporting a substrate of claim 4 ,
wherein the flow path is provided as a pipe inserted into the space between the first plate member and the second plate member, or a groove formed on at least one surface of at least one member of the first plate member and the second plate member.

6. The apparatus for transporting a substrate of claim 5 ,
wherein the groove is formed in the first plate member, and the groove is formed on a surface of the first plate member that contacts the second plate member when the first plate member and the second plate member are coupled.

7. The apparatus for transporting a substrate of claim 5 ,
wherein the groove is formed in the second plate member, and the groove is formed on a surface of the second plate member that contacts the first plate member when the first plate member and the second plate member are coupled.

8. The apparatus for transporting a substrate of claim 4 ,
wherein at least one of a thermal compound, a thermal pad, and a thermal grease is installed on the flow path.

9. The apparatus for transporting a substrate of claim 4 ,
wherein the flow path is formed in a zigzag shape.

10. The apparatus for transporting a substrate of claim 4 ,
wherein the first plate member and/or the second plate member are configured to discharge cold air.

11. The apparatus for transporting a substrate of claim 4 ,
wherein the cooling plate further comprises,
a pump for supplying coolant to the flow path; and
a valve for controlling a flow of coolant by opening and closing the flow path.

12. An apparatus for transporting a substrate comprising:
a transporting unit for transporting a substrate;
a guide rail for providing a moving path of the transporting unit;
a support block coupled to an upper portion of the guide rail to support a lower surface the transporting unit, and sliding along the guide rail; and
a cooling plate for controlling a temperature of the transporting unit,
wherein the cooling plate is aligned facing a side surface of the transporting unit and installed as a side wall extending along the guide rail, the side surface of the transporting unit including one of a plurality of protrusions and a plurality of grooves, the cooling plate including another one of the plurality of protrusions and the plurality of grooves, wherein the transporting unit is in movable contact with the plurality of protrusions inserted into respective ones of the plurality of grooves,
wherein a flow path, through which coolant flows, is installed inside the cooling plate,
wherein at least one of a thermal compound, a thermal pad, and a thermal grease is installed on the flow path.

13. A system for treating a substrate comprising:
a first process chamber for treating a substrate;
a second process chamber for treating the substrate;
a substrate transporting device including a transporting unit for transporting the substrate between the first process chamber and the second process chamber;
a guide rail for providing a moving path of the transporting unit;
a support block coupled to an upper portion of the guide rail to support a lower surface the transporting unit, and sliding along the guide rail; and
a cooling plate for controlling a temperature of the transporting unit,
wherein the cooling plate is aligned facing a side surface of the transporting unit and installed as a side wall extending along the guide rail, the side surface of the transporting unit including one of a plurality of protrusions and a plurality of grooves, the cooling plate including another one of the plurality of protrusions and the plurality of grooves, wherein the transporting unit is in movable contact with the plurality of protrusions inserted into respective ones of the plurality of grooves.

14. The system for treating a substrate of claim 13 ,
wherein a flow path, through which coolant flows, is installed inside the cooling plate.

15. The system for treating a substrate of claim 14 ,
wherein at least one of a thermal compound, a thermal pad, and a thermal grease is installed on the flow path.

Assignees

• Semes Co Ltd

Inventors

• Ha Sun Ho
• Son Duk Hyun

Classifications

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0464 Primary

  characterised by the construction of the transfer chamber · CPC title

• B65G69/20

  Auxiliary treatments, e.g. aerating, heating, humidifying, deaerating, cooling, de-watering or drying, during loading or unloading; Loading or unloading in a fluid medium other than air · CPC title

• H01L21/67748

  Electricity · mapped topic

• B65G47/90

  Devices for picking-up and depositing articles or materials · CPC title