Substrate processing apparatus and substrate processing method for performing cleaning process and the like on substrate

Patent metadata

Field	Value
Publication number	US-9327918-B2
Application number	US-201314019595-A
Country	US
Kind code	B2
Filing date	Sep 6, 2013
Priority date	Oct 1, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

For the transport of a substrate from a cassette to a back surface cleaning processing unit in a cleaning processing block, a transfer robot rotates the substrate through 90 degrees from a horizontal attitude in which the front surface of the substrate is positioned to face upward into a standing attitude while transporting the substrate out of a cassette to a substrate passing part, and passes the substrate in the standing attitude to the substrate passing part. The substrate passing part holds the substrate in the standing attitude. A main transport robot receives the substrate held in the standing attitude. The main transport robot rotates the substrate through 90 degrees from the standing attitude into a horizontal attitude in which the back surface of the substrate is positioned to face upward while transporting the substrate from the substrate passing part to the back surface cleaning processing unit.

First claim

What is claimed is:

1. A method of processing a substrate, comprising the steps of:
(a) taking an unprocessed substrate out of a cassette to pass the unprocessed substrate to a passing part by means of a transfer robot while rotating the unprocessed substrate through 90 degrees about a second rotation axis extending in a horizontal direction;
(b) holding said unprocessed substrate received from said transfer robot in a standing attitude by means of said passing part;
(c) transferring said unprocessed substrate from said passing part to a main transport robot to transport said unprocessed substrate to a processing part by means of said main transport robot while rotating said unprocessed substrate through 90 degrees about a first rotation axis extending in a horizontal direction;
(d) transferring a processed substrate from said processing part to said main transport robot to pass said processed substrate to said passing part by means of said main transport robot while rotating said processed substrate through 90 degrees about said first rotation axis;
(e) holding said processed substrate received from said main transport robot in a standing attitude by means of said passing part; and
(f) transferring said processed substrate from said passing part to said transfer robot to transport said processed substrate into a cassette by means of said transfer robot while rotating said processed substrate through 90 degrees about said second rotation axis,
said steps (a) and (f) including the step of moving a second hand for gripping said substrate forwardly and backwardly in a direction parallel to said second rotation axis by means of said transfer robot,
said steps (c) and (d) including the step of moving a first hand for gripping said substrate forwardly and backwardly in a direction parallel to said first rotation axis by means of said main transport robot,
said steps (a) and (f) including the step of moving the substrate upwardly and downwardly in a vertical direction by means of said transfer robot while maintaining the substrate in a standing attitude without pivoting,
said steps (c) and (d) include the step of moving the substrate upwardly and downwardly in a vertical direction by means of said main transport robot while maintaining the substrate in a standing attitude without pivoting, wherein
said processing part includes a back surface cleaning processing unit for cleaning the back surface of a substrate; and
said transfer robot rotates said substrate received from said cassette through 90 degrees in said step (a) and said main transport robot rotates said substrate received from said passing part through 90 degrees in said step (c) to invert and transport the substrate to said back surface cleaning processing unit.

2. The method according to claim 1 , wherein said processing part includes a front surface cleaning processing unit for cleaning the front surface of a substrate, the method further comprising the step of
(g) transporting a substrate taken out of said back surface cleaning processing unit to said front surface cleaning processing unit by means of said main transport robot while rotating said substrate through 180 degrees about said first rotation axis.

3. The method according to claim 1 , wherein:
said substrate is a semiconductor wafer having a diameter of 450 mm.

4. The method according to claim 1 , wherein:
at least one first forward and backward moving mechanism of said main transport robot is provided closer to an edge of said first hand than to said first rotation mechanism; and
at least one second forward and backward moving mechanism of said transfer robot is provided closer to an edge of said second hand than to said second rotation mechanism.

5. The method according to claim 4 , wherein:
said at least one first forward and backward moving mechanism comprises two first forward and backward moving mechanisms each being provided with said first hand and for independently moving the corresponding first hand forwardly and backwardly; and
said at least one second forward and backward moving mechanism comprises two second forward and backward moving mechanisms each being provided with said second hand and for independently moving the corresponding second hand forwardly and backwardly.

6. A method of processing a substrate, comprising the steps of:
(a) receiving a processed substrate from a back surface cleaning processing unit for cleaning the back surface of a substrate to pass the processed substrate to a passing part by means of a main transport robot while rotating the processed substrate through 90 degrees about a first rotation axis extending in a horizontal direction;
(b) holding said processed substrate received from said main transport robot in a standing attitude by means of said passing part;
(c) receiving said processed substrate from said passing part to transport and store said processed substrate into a cassette by means of a transfer robot while rotating said processing substrate through 90 degrees about a second rotation axis extending in a horizontal direction;
said step (a) including the step of moving a first hand for gripping said substrate forwardly and backwardly in a direction parallel to said first rotation axis by means of said main transport robot,
said step (c) including the step of moving a second hand for gripping said substrate forwardly and backwardly in a direction parallel to said second rotation axis by means of said transfer robot,
said step (a) including the step of moving the substrate upwardly and downwardly in a vertical direction by means of said main transport robot while maintaining the substrate in a standing attitude without pivoting, and
said step (c) including the step of moving the substrate upwardly and downwardly in a vertical direction by means of said transfer robot while maintaining the substrate in a standing attitude without pivoting, wherein
said main transport robot rotates said substrate received from said back surface cleaning processing unit through 90 degrees in said step (a) and said transfer robot rotates said substrate received from said passing part through 90 degrees in said step (c) to invert and transport the substrate to said cassette.

7. The method according to claim 6 , wherein
before said step (a), said main transport robot receives the substrate from a front surface cleaning processing unit for cleaning the front surface of a substrate, the substrate being subjected to the front surface cleaning, to transport the substrate to said back surface cleaning processing unit while rotating the substrate through 180 degrees about said first rotation axis.

Assignees

• Dainippon Screen Mfg
• Screen Holdings Co Ltd

Inventors

• Hayashi Motoyasu
• Shibukawa Jun
• Takahashi Mitsukazu

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3412

  Batch transfer of wafers · CPC title

• H10P72/3402 Primary

  Mechanical parts of transfer devices · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0466 Primary

  characterised by the construction of the load-lock chamber · CPC title