Dissolution guided wetting of structured surfaces

US11566213B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11566213-B2
Application numberUS-201916525191-A
CountryUS
Kind codeB2
Filing dateJul 29, 2019
Priority dateMay 31, 2012
Publication dateJan 31, 2023
Grant dateJan 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.

First claim

Opening claim text (preview).

That which is claimed is: 1. A microfabricated device comprising: a substrate material fabricated to comprise a structured surface formed therein, at least one gas-entrapping feature on the structured surface that entraps gas bubbles upon wetting said structured surface with an aqueous or non-aqueous solvent or solution, wherein the substrate material comprises an array of microwells formed therein; and a sacrificial residue in contact with the at least one gas-entrapping feature, wherein the sacrificial residue is soluble in an aqueous or non-aqueous solvent or solution, wherein the sacrificial residue is configured to cause dissolution guided wetting upon contact with the aqueous or non-aqueous solvent or solution to thereby fill the at least one gas-entrapping feature without entrapping gas bubbles. 2. The device of claim 1 , wherein said gas-entrapping feature comprises a well, corner, microcavity, dead end, post, trap, hole, passage, channel, or combination thereof. 3. The device of claim 1 , wherein said device is comprised of an organic polymer. 4. The device of claim 1 , wherein said substrate is comprised of a polymer selected from the group consisting of as polymethylmethacrylate (PMMA), polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polydimethylsiloxane (PDMS), polysulfone, polystyrene, polymethylpentene, polypropylene, polyethylene, polyvinyl idine fluoride, acrylonitrile-butadiene-styrene copolymer (ABS), polymerized photoresists, and combinations thereof. 5. The device of claim 1 , wherein the sacrificial residue is dissolvable in the aqueous solvent or solution and is comprised of a salt, carbohydrate, hydrophilic polymer, dextran, polyethylene glycol, alginate, agarose, chitosan, glucose, sucrose, non-metabolizable carbohydrate, or sorbitol. 6. The device of claim 1 , wherein the sacrificial residue is dissolvable in the non-aqueous solvent or solution and is comprised of a hydrophobic polymer, low molecular weight organic solid, non-volatile liquid, polyethylene, polypropylene, polyvinyl chloride, polystyrene, nylon, polyester, acrylic, polyurethane, polycarbonate, polylactic acid, poly(lactic-co-glycolic acid), poly(methyl methacrylate), paraffin wax, naphthalene, anthracene, aspirin (acetylsalicylic acid), 2-naphthol, fat, synthetic oil, mineral oil, vegetable oil, olive oil, lipid, silicone oil, or liquid epoxy resin. 7. A method of priming a microfabricated device for dissolution guided wetting of gas-entrapping features, comprising: (a) providing a microfabricated device comprising a substrate material fabricated to comprise a structured surface formed therein, at least one gas-entrapping feature on the structured surface that entraps gas bubbles upon wetting the structured surface with an aqueous or non-aqueous solvent or solution, wherein the substrate material comprises an array of microwells formed therein; (b) applying a sacrificial residue to the at least one gas-entrapping feature on the structured surface, wherein the sacrificial residue is soluble in an aqueous or non-aqueous solvent or solution, wherein the sacrificial residue becomes dissolved in the aqueous or non-aqueous solvent or solution upon wetting the structured surface thereby inhibiting the entrapment of gas bubbles therein through dissolution guided wetting. 8. The method of claim 7 , wherein the sacrificial residue comprises a solute dissolved or dispersed in a second solvent or solution and the applying comprises contacting the solute dissolved or dispersed in the second solvent or solution with the at least one gas-entrapping feature, and allowing the second solvent or solution to dry thereon thereby depositing the solute in contact with the gas-entrapping feature. 9. The method of claim 7 , wherein the sacrificial residue is applied to the at least one gas-entrapping feature as a fine particulate dust. 10. The method of claim 7 , wherein the device is comprised of an organic polymer. 11. The method of claim 7 , wherein the substrate is comprised of a polymer selected from the group consisting of as polymethylmethacrylate (PMMA), polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polydimethylsiloxane (PDMS), polysulfone, polystyrene, polymethylpentene, polypropylene, polyethylene, polyvinylidine fluoride, acrylonitrile-butadiene-styrene copolymer (ABS), polymerized photoresists, and combinations thereof. 12. The method of claim 7 , wherein the sacrificial residue is dissolvable in the aqueous solvent or solution and is comprised of dextran, polyethylene glycol, alginate, agarose, chitosan, glucose, sucrose, non-metabolizable carbohydrate, or sorbitol. 13. The method of claim 7 , further comprising treating the microfabricated device with plasma oxidation prior to applying the sacrificial residue to the at least one gas-entrapping feature on the structured surface. 14. The method of claim 7 , wherein the sacrificial residue is dissolvable in the non-aqueous solvent or solution and is comprised of a hydrophobic polymer, low molecular weight organic solid, non-volatile liquid, polyethylene, polypropylene, polyvinyl chloride, polystyrene, nylon, polyester, acrylic, polyurethane, polycarbonate, polylactic acid, poly(lactic-co-glycolic acid), poly(methyl methacrylate), paraffin wax, naphthalene, anthracene, aspirin (acetylsalicylic acid), 2-naphthol, fat, synthetic oil, mineral oil, vegetable oil, olive oil, lipid, silicone oil, or liquid epoxy resin. 15. The method of claim 7 , wherein the microwells further comprise a releasable element positioned at the bottom of each of the microwells. 16. A method of wetting a microfabricated device while inhibiting the entrapment of gas bubbles therein, comprising: (a) providing a microfabricated device comprising a substrate material fabricated to comprise a structured surface formed therein, wherein the substrate material comprises an array of microwells formed therein, at least one gas-entrapping feature on the structured surface that entraps gas bubbles upon wetting the structured surface with an aqueous or non-aqueous solvent or solution, and a sacrificial residue in contact with the at least one gas-entrapping feature, wherein the sacrificial residue is soluble in an aqueous or non-aqueous solvent or solution; and (b) treating the microfabricated device with the aqueous or non-aqueous solvent or solution sufficient to dissolve and remove the sacrificial residue from the at least one gas-entrapping feature while concurrently wetting the at least one gas-entrapping feature with the solvent or solution thereby inhibiting the entrapment of gas bubbles therein through dissolution guided wetting. 17. The method of claim 16 , wherein the aqueous solvent or solution comprises a growth media, an assay or reagent media, or a reaction media. 18. The method of claim 16 , wherein the gas-entrapping feature comprises a well, corner, microcavity, dead end, post, trap, hole, passage, channel, or combination thereof. 19. The method of claim 16 , wherein the microwells further comprise a releasable element positioned at the bottom of each of the microwells. 20. The method of claim 16 , wherein the device is comprised of an organic polymer. 21. The method of claim 16 , wherein the substrate is comprised of a polymer selected from the group consisting of as polymethylmethacrylate (PMMA), polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polydimethylsiloxane (PDMS), polysulfone, polystyrene, polymethylpentene, polypropylene, p

Assignees

Inventors

Classifications

  • Degassing; Venting; Bubble traps (means for collection or storage of gas C12M23/36; gas collection apparatus for laboratory use B01L5/02) · CPC title

  • Specific details about manufacturing devices · CPC title

  • Well or multiwell plates (C12M25/04 takes precedence) · CPC title

  • Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties · CPC title

  • by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip · CPC title

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What does patent US11566213B2 cover?
A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.
Who is the assignee on this patent?
Univ North Carolina Chapel Hill
What technology area does this patent fall under?
Primary CPC classification C12M23/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).