Dissolution guided wetting of structured surfaces

US10364411B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10364411-B2
Application numberUS-201815995360-A
CountryUS
Kind codeB2
Filing dateJun 1, 2018
Priority dateMay 31, 2012
Publication dateJul 30, 2019
Grant dateJul 30, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.

First claim

Opening claim text (preview).

That which is claimed is: 1. A microfabricated device comprising: a substrate material comprising an array of microwells formed therein, wherein the array of microwells defines at least one gas-entrapping feature that entraps gas bubbles upon wetting said array of microwells with a solvent or solution, and a sacrificial residue in contact with said at least one gas-entrapping feature, wherein the sacrificial residue is soluble in a solvent or solution, wherein the sacrificial residue is configured to cause dissolution guided wetting upon contact with the solvent or solution to thereby fill the at least one gas-entrapping feature without entrapping gas bubbles. 2. The device of claim 1 , wherein said array of microwells defining at least one gas-entrapping feature comprises a well, corner, microcavity, dead end, post, trap, hole, or combination thereof. 3. The device of claim 1 , said microwells further comprising a releasable element positioned at the bottom of each of said microwells. 4. The device of claim 1 , wherein said device further comprises a microfluidic network, having a plurality of regions with said gas-entrapping feature in one or more regions of said microfluidic network. 5. The device of claim 1 , wherein said device is comprised of an organic polymer. 6. The device of claim 1 , wherein said substrate is comprised of a polymer selected from the group consisting of as polymethylmethacrylate (PRIMA), polycarbonate, polytetrafluoroethylene (PTFE), polyvinylchloride (PVC), polydimethylsiloxane (PDMS), polysulfone, polystyrene, polymethylpentene, polypropylene, polyethylene, polyvinylidine fluoride, acrylonitrile-butadienestyrene copolymer (ABS), polymerized photoresists, and combinations thereof. 7. The device of claim 1 , wherein the array of microwells of said substrate is oxidized. 8. The device of claim 1 , wherein said sacrificial residue is dissolvable in an aqueous solution. 9. The device of claim 1 , wherein said sacrificial residue is comprised of a salt, carbohydrate, or hydrophilic polymer. 10. The device of claim 1 , wherein said sacrificial residue is comprised of dextran, polyethylene glycol, alginate, agarose, chitosan, glucose, sucrose or sorbitol. 11. The device of claim 1 , wherein said sacrificial residue is comprised of a non-metabolizable carbohydrate. 12. The device of claim 1 , packaged in a water-proof container, and/or packaged in a container with a desiccant. 13. A method of wetting a microfabricated device while inhibiting the entrapment of gas bubbles therein, comprising: (a) providing a microfabricated device comprising a substrate material comprising an array of microwells formed therein, wherein the array of microwells defines at least one gas-entrapping feature that entraps gas bubbles upon wetting said array of microwells with a solvent or solution, and a sacrificial residue in contact with said at least one gas-entrapping feature; (b) priming the microfabricated device with a sacrificial residue in contact with said at least one gas-entrapping feature, wherein the sacrificial residue is soluble in a solvent or solution, and (c) treating said microfabricated device with a solvent or solution sufficient to dissolve said sacrificial residue to cause dissolution guided wetting of the at least one gas-entrapping feature without entrapping gas bubbles. 14. The method of claim 13 , wherein said solvent or solution comprises a growth media, an assay or reagent media, or a reaction media.

Assignees

Inventors

Classifications

  • characterised by the manufacture of the container or its components · CPC title

  • Specific details about manufacturing devices · CPC title

  • Control and use of surface tension forces, e.g. hydrophobic, hydrophilic · CPC title

  • involving viable microorganisms · CPC title

  • Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties · CPC title

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Frequently asked questions

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What does patent US10364411B2 cover?
A microfabricated device having at least one gas-entrapping feature formed therein in a configuration that entraps air bubbles upon wetting the feature with a solvent or solution is described. The device includes a sacrificial residue in contact with the gas-entrapping feature, the dissolution of which guides the wetting of the gas-entrapping feature.
Who is the assignee on this patent?
Univ North Carolina Chapel Hill
What technology area does this patent fall under?
Primary CPC classification C12M23/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).