Laser processing device and laser processing method

Patent metadata

Field	Value
Publication number	US-11565345-B2
Application number	US-201916408681-A
Country	US
Kind code	B2
Filing date	May 10, 2019
Priority date	Nov 22, 2016
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

First claim

The invention claimed is:

1. A laser processing device comprising:
a laser oscillator as a laser source;
a laser-beam switcher that selectively switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including a first fiber, the second optical path including a second fiber that has a core diameter that is larger than a core diameter of the first fiber;
a laser illuminator that illuminates a same processed point on a workpiece with a laser beam that has passed through the first optical path and a laser beam that has passed through the second optical path;
a controller located in the laser oscillator and configured to perform various control operations of the laser processing device including, when a predetermined condition is satisfied, control the laser-beam switcher to switch from the first optical path to the second optical path; and
a detector that detects variation of a reflected laser beam that is the laser beam that has been used to illuminate the workpiece and is reflected by the workpiece,
wherein when the detector detects variation of the reflected laser beam, the controller is configured to control the laser-beam switcher to switch from the first optical path to the second optical path,
in the first optical path, the laser oscillator, the laser-beam switcher, the first fiber, and the laser illuminator are arranged in this order, and
in the second optical path, the laser oscillator, the laser-beam switcher, the second fiber, and the laser illuminator are arranged in this order.

2. The laser processing device according to claim 1 , wherein when illumination with the laser beam that has passed through the first optical path is performed for a predetermined period of time, the controller causes the laser-beam switcher to switch from the first optical path to the second optical path.

3. A laser processing method comprising:
a first illuminating step of illuminating a processed point on a workpiece with a first laser beam until a predetermined condition is satisfied, the first laser beam having been passed through a first optical path by making a switch between optical paths of a laser beam,
in the first optical path, a laser oscillator, a laser-beam switcher, a first fiber, and a laser illuminator are arranged in this order, and
a second illuminating step of illuminating, when the predetermined condition is satisfied, the processed point on the workpiece with a second laser beam that has been passed through a second optical path by making the switch between the optical paths of the one laser beam, and thus has power density that is lower than power density of the first laser beam,
in the second optical path, the laser oscillator, the laser-beam switcher, a second fiber, and the laser illuminator are arranged in this order,
wherein when variation of a reflected laser beam that is the first laser beam that has been used to illuminate the workpiece and is reflected by the workpiece is detected, in the second illuminating step, the processed point is illuminated with the second laser beam.

4. The laser processing method according to claim 3 , wherein when illumination with the first laser beam that has passed through the first optical path is performed for a predetermined period of time, in the second illuminating step, the processed point is illuminated with the second laser beam.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nagayasu Doukei
• Nishimura Hitoshi
• Wang Jingbo
• Ryudo Makoto
• Nishio Masatoshi
• Yamaguchi Hideaki
• Takenaka Yoshiaki
• Eizumi Kiyotaka
• Ishikawa Ryo

Classifications

• B23K26/0643 Primary

  comprising mirrors · CPC title

• B23K26/0613

  having a common axis (B23K26/0619 takes precedence) · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K26/064

  by means of optical elements, e.g. lenses, mirrors or prisms · CPC title

• B23K26/0648

  comprising lenses · CPC title