Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device

Patent metadata

Field	Value
Publication number	US-11560465-B2
Application number	US-201816498798-A
Country	US
Kind code	B2
Filing date	Mar 30, 2018
Priority date	Mar 31, 2017
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

First claim

The invention claimed is:

1. A curable resin composition containing
(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2),
(B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups,
(C) a curing agent, and
(D) a triazole-based compound,

wherein in the formula (1), R represents an acyclic alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or an acyclic alkyl group having 1 to 12 carbon atoms, as a substituent; and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, at least one Z represents a linking group, and benzoxazine rings are linked by the linking group;

wherein in the formula (2), L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the divalent organic group and the alkylene group optionally comprise oxygen and/or sulfur, and
wherein the multifunctional epoxy compound (B) has at least one moiety represented by the following formula (4)

2. The curable resin composition according to claim 1 , further containing (E) a curing accelerator.

3. The curable resin composition according to claim 1 , further containing (F) an inorganic filler.

4. The curable resin composition according to claim 1 , wherein the triazole-based compound (D) is a compound having a 1,2,4-triazole ring.

5. The curable resin composition according to claim 1 , wherein the triazole-based compound (D) is a compound represented by general formula (9-1):

wherein R 1 , R 2 , and R 3 each independently represent a hydrogen atom, an amino group, a mercapto group, an alkyl group, an aryl group, or a carboxy group, and the alkyl group and the aryl group are optionally substituted, provided that at least one of R 1 , R 2 , and R 3 represents a mercapto group.

6. The curable resin composition according to claim 1 , wherein the triazole-based compound (D) is a compound represented by general formula (9-5):

wherein R 1 represents a hydrogen atom or an amino group.

7. The curable resin composition according to claim 1 , wherein the compounding ratio of the triazole-based compound (D) is 0.1 to 30 parts by mass based on 100 parts by mass in total of (A), (B) and (C).

8. The curable resin composition according to claim 1 , the triazole-based compound (D) has at least one mercapto group.

9. A cured product obtained by curing the curable resin composition according to claim 1 .

10. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 1 .

11. A method of producing a curable resin composition, the method comprising:
a step of mixing

(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2),
(B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups,
(C) a curing agent, and
(D) a triazole-based compound to obtain a mixture; and
a step of processing the mixture into a powdery, pelletized, or granular curable resin composition;

wherein in the formula (1), R represents an acyclic alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or an acyclic alkyl group having 1 to 12 carbon atoms, as a substituent; and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, at least one Z represents a linking group, and benzoxazine rings are linked by the linking group;

wherein in the formula (2), L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the divalent organic group and the alkylene group optionally comprise oxygen and/or sulfur; and
wherein the multifunctional epoxy compound (B) has at least one moiety represented by the following formula (4)

12. The method of producing a curable resin composition according to claim 10 , wherein the mixture is obtained by further mixing (E) a curing accelerator and/or (F) an inorganic filler.

13. A method of producing of a cured product, the method comprising
a step of heating the curable resin composition produced by the method according to claims 10 to 180 to 300° C. for curing.

Assignees

• Eneos Corp

Inventors

• Nishitani Yoshinori
• Minami Masaki

Classifications

• C08L79/04

  Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

• H01L23/295

  Electricity · mapped topic

• C08K5/3472 Primary

  Five-membered rings · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title