Curable silicone composition and optical semiconductor device

Patent metadata

Field	Value
Publication number	US-9464211-B2
Application number	US-201314426524-A
Country	US
Kind code	B2
Filing date	Sep 6, 2013
Priority date	Sep 7, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.

First claim

The invention claimed is:

1. A hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element; the hydrosilylation reaction curable silicone composition comprising at least one compound selected from the group consisting of triazole-based compounds with the exception of non-substituted benzotriazole, wherein the triazole-based compound is selected from the group consisting of N-alkyl substituted triazoles, N-alkylaminoalkyl substituted triazoles, alkyl substituted benzotriazoles, carboxy substituted benzotriazoles, and nitro substituted benzotriazoles.

2. The hydrosilylation reaction curable silicone composition according to claim 1 ; wherein the hydrosilylation reaction curable silicone composition comprises:
(A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule;
(B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule;
(C) at least one type of compound selected from the group consisting of triazole-based compounds with the exception of non-substituted benzotriazole; and
(D) a hydrosilylation reaction catalyst.

3. The hydrosilylation reaction curable silicone composition according to claim 2 ; wherein component (A) is an organopolysiloxane represented by the following average composition formula:
(R 1 SiO 3/2 ) a (R 2 R 3 SiO 2/2 ) b (R 4 R 5 R 6 SiO 1/2 ) c (SiO 4/2 ) d
wherein, R 1 to R 6 may be identical or different monovalent hydrocarbon groups, from 0.01 to 50 mol % of all monovalent hydrocarbon groups are aliphatic unsaturated hydrocarbon groups; a, b, c, and d represent mole ratios of the respective siloxane units and are numbers that respectively satisfy: a+b+c+d=1.0, 0≦a≦1.0, 0≦b≦1.0, 0≦c<0.83, and 0≦d<0.50.

4. The hydrosilylation reaction curable silicone composition according to claim 3 ; wherein component (B) is an organohydrogenpolysiloxane represented by the following average composition formula:
R 7 e H f SiO [(4-e-f)/2]
wherein, R 7 is a substituted or non-substituted monovalent hydrocarbon group with the exception of aliphatic unsaturated hydrocarbon groups; and e and f are numbers that respectively satisfy: 1.0≦e≦2.0, 0.1<f<1.0, and 1.5≦e+f<2.7.

5. The hydrosilylation reaction curable silicone composition according to claim 2 ; wherein component (B) is an organohydrogenpolysiloxane represented by the following average composition formula:
R 7 e H f SiO [(4-e-f)/2]
wherein, R 7 is a substituted or non-substituted monovalent hydrocarbon group with the exception of aliphatic unsaturated hydrocarbon groups; and e and f are numbers that respectively satisfy: 1.0≦e≦2.0, 0.1<f<1.0, and 1.5≦e+f<2.7.

6. An optical semiconductor device fabricated by using the hydrosilylation reaction curable silicone composition described in claim 1 for sealing, coating, or adhering an optical semiconductor element.

7. The optical semiconductor device according to claim 6 , wherein the optical semiconductor element is a light emitting diode.

8. The hydrosilylation reaction curable silicone composition according to claim 1 ; wherein the triazole-based compound is selected from the group consisting of N,N-bis(2-ethylhexyl)-[(1,2,4-triazol-1-yl)methyl]amine, tolyl triazole, carboxybenzotriazole, and nitrobenzotriazole.

9. The hydrosilylation reaction curable silicone composition according to any claim 1 ; wherein a content of the triazole-based compound in the hydrosilylation reaction curable silicone composition is 0.01 ppm to 3% by mass.

Assignees

• Dow Cornging Toray Co Ltd
• Dow Corning Toray Co Ltd

Inventors

• Miyamoto Yusuke
• Yoshitake Makoto
• Yoshida Hiroaki
• Nakata Toshiki
• Hirai Kazuo

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title