Display device

Patent metadata

Field	Value
Publication number	US-11557641-B2
Application number	US-202017060771-A
Country	US
Kind code	B2
Filing date	Oct 1, 2020
Priority date	Feb 25, 2020
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

First claim

What is claimed is:

1. A display device, comprising:
a display panel including panel pads adjacent to a side surface of the display panel;
connection pads disposed on the side surface of the display panel and connected to the panel pads; and
a circuit board disposed on the side surface of the display panel, the circuit board including lead signal lines directly bonded to the connection pads, wherein
the connection pads include:
a first connection pad;
a second connection pad disposed on the first connection pad; and
a third connection pad disposed on the second connection pad,

the first connection pad is in contact with corresponding one of the panel pads, and
the third connection pad is directly bonded to corresponding one of the lead signal lines.

2. The display device of claim 1 , wherein the third connection pad is ultrasonically bonded to the corresponding one of the lead signal lines.

3. The display device of claim 2 , wherein an interface between the third connection pad and the corresponding one of the lead signal lines has a non-flat shape.

4. The display device of claim 1 , wherein a melting point of the third connection pad is lower than a melting point of the second connection pad and a melting point of the first connection pad.

5. The display device of claim 4 , wherein the melting point of the third connection pad is about 270° C. or lower.

6. The display device of claim 1 , wherein the third connection pad has a thickness smaller than or equal to a half of an interval between neighboring second connection pads.

7. The display device of claim 6 , wherein the thickness of the third connection pad is equal to or greater than about 1 μm.

8. The display device of claim 1 , wherein
the display panel includes a substrate, and
an end of the panel pad is aligned with a side surface of the substrate.

9. The display device of claim 8 , wherein the connection pad protrudes outward from the side surface of the substrate.

10. A display device including a display area and a non-display area surrounding the display area, the display device comprising:
a display panel including a pad area disposed on a side surface of the non-display area;
a connection pad disposed on the pad area; and
a circuit board disposed on the connection pad, wherein
the display panel includes at least one panel pad adjacent to the pad area,
the connection pad is connected to the at least one panel pad,
the circuit board includes a lead signal line directly bonded to the connection pad,
the connection pad includes:
a first connection pad;
a second connection pad disposed on the first connection pad; and
a third connection pad disposed on the second connection pad,

the first connection pad is in contact with the at least one panel pad, and
the third connection pad is directly bonded to the lead signal line.

11. The display device of claim 10 , wherein the connection pad is ultrasonically bonded to the lead signal line.

12. The display device of claim 11 , wherein an interface between the connection pad and the lead signal line has a non-flat shape.

13. The display device of claim 10 , wherein the connection pad includes a first material selected from nickel (Ni), chromium (Cr), copper (Cu), indium (In), tin (Sn), silver (Ag), titanium (Ti), molybdenum (Mo), or any combination thereof.

14. The display device of claim 13 , wherein the first material includes at least one selected from NiCr/Cu/InSnAg, Ti/Cu/InSnAg, and MoTi/Cu/InSnAg.

15. The display device of claim 13 , wherein the lead signal line includes a second material including Sn.

16. The display device of claim 15 , wherein the first material and the second material are mixed in an area between the connection pad and the lead signal line.

17. The display device of claim 10 , wherein a melting point of the third connection pad is lower than a melting point of the second connection pad and a melting point of the first connection pad.

18. The display device of claim 10 , wherein the third connection pad has a thickness smaller than or equal to a half of an interval between neighboring second connection pads.

19. The display device of claim 10 , wherein the display panel includes:
a substrate;
a first conductive layer on the substrate;
a first insulating layer on the first conductive layer;
a second conductive layer on the first insulating layer;
a second insulating layer on the second conductive layer; and
a third conductive layer on the second insulating layer,
wherein the third conductive layer includes the at least one panel pad.

20. The display device of claim 19 , wherein the connection pad protrudes outward from a side surface of the substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Byeong Beom
• Kim Min Ki
• Kim Yu Ri
• Seo Woo Suk
• Lee Hoi Kwan

Classifications

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K2201/0919

  Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes · CPC title

• H05K3/027

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title