Method for monitoring quality of hot stamped components

US11554404B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11554404-B2
Application numberUS-202016819494-A
CountryUS
Kind codeB2
Filing dateMar 16, 2020
Priority dateFeb 19, 2016
Publication dateJan 17, 2023
Grant dateJan 17, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A controller alters a cycle time of a die arrangement, configured to hot stamp metal into components and having an active cooling system, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state.

First claim

Opening claim text (preview).

What is claimed is: 1. A hot stamping system comprising: a controller (i) in digital communication with a die arrangement that is configured to hot stamp metal into components and having an active cooling system, and (ii) programmed to alter a cycle time of the die arrangement based on an amount of heat (Q E ) that is transferred from the components to the active cooling system and derived from a plurality of parameters indicative of a change in a measured temperature and at least one of a component material specification, weight, geometry, thickness, heat capacity, or latent heat such that the cycle time is decreased responsive to the amount exceeding a threshold amount (Q T ) that is indicative of a grain structure of the components transition from an austenitic state to a martensitic state. 2. The system of claim 1 , wherein the controller is further programmed to alter the cycle time such that the cycle time is increased responsive to the amount being less than the threshold amount. 3. The system of claim 1 , wherein the plurality of parameters further includes inlet and outlet flow rates associated with the active cooling system. 4. The system of claim 1 , wherein the measured temperature is a temperature of the die arrangement. 5. A hot stamping system comprising: a die arrangement including an active cooling system; and a controller in digital communication with the die arrangement and programmed to close the die arrangement to hot stamp metal into a component, and in response to an amount of heat (Q E ) transferred from the component to the active cooling system exceeding a threshold amount (Q T ) indicative of a phase transformation of the component from austenite to martensite, to open the die arrangement, wherein Q E is derived from a measured temperature and component details of material specification, weight, geometry, and/or thickness. 6. The system of claim 5 , wherein the controller is further programmed to keep the die arrangement closed in response to the amount being less than the threshold amount (Q T ). 7. The system of claim 5 , wherein the measured temperature is a temperature or change in temperature of the die arrangement. 8. The system of claim 5 , wherein the measured temperature is a temperature or change in temperature of the component. 9. The system of claim 1 , wherein the controller in digital communication with the die arrangement via a computer system. 10. The system of claim 1 , wherein the amount of heat Q E transferred to the active cooling system is determined after determining the die arrangement has reached a steady state. 11. The system of claim 10 , wherein the steady state is a stabilized temperature. 12. The system of claim 1 , wherein the amount of heat Q E transferred to the active cooling system is determined by monitoring a cooling channel in the die arrangement. 13. The system of claim 12 , wherein the cooling channel includes sensors for measuring an inlet temperature and an outlet temperature of the cooling channel. 14. The system of claim 1 , wherein Q E is derived from the component material specification, weight, geometry, thickness, heat capacity, and/or latent heat and the change in the measured temperature. 15. The system of claim 1 , wherein Q E is derived from the component material specification, weight, and the change in the measured temperature. 16. The system of claim 1 , wherein Q E is derived from the component weight, latent heat, and the change in the measured temperature.

Assignees

Inventors

Classifications

  • for cooling · CPC title

  • B21D22/022Primary

    by heating the blank or stamping associated with heat treatment (C21D takes precedence) · CPC title

  • other parts for vehicles, e.g. cowlings, mudguards · CPC title

  • C21D1/18Primary

    Hardening (C21D1/02 takes precedence); Quenching with or without subsequent tempering (quenching devices C21D1/62) · CPC title

  • Martensite · CPC title

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What does patent US11554404B2 cover?
A controller alters a cycle time of a die arrangement, configured to hot stamp metal into components and having an active cooling system, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state.
Who is the assignee on this patent?
Ford Global Tech Llc
What technology area does this patent fall under?
Primary CPC classification B21D22/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 17 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).