Method for monitoring quality of hot stamped components

Patent metadata

Field	Value
Publication number	US-11229935-B2
Application number	US-201615299900-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Oct 21, 2016
Publication date	Jan 25, 2022
Grant date	Jan 25, 2022

Abstract

A hot stamping system includes a controller programmed to alter a coolant flow rate, without altering cycle time, in an active cooling system of a die arrangement, configured to hot stamp metal into components, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state while the die arrangement is closed.

First claim

What is claimed is:

1. A hot stamping system comprising:
a controller programmed to alter a coolant flow rate, without altering cycle time, in an active cooling system of a die arrangement, configured to hot stamp metal into components, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state while the die arrangement is closed, wherein altering the flow rate includes adjusting the flow rate in a main inlet, side channels, or both of the active cooling system.

2. The system of claim 1 , wherein altering the flow rate further includes decreasing the flow rate in response to the amount exceeding a threshold amount.

3. The system of claim 1 , wherein altering the flow rate further includes increasing the flow rate in response to the amount being less than a threshold amount.

4. The system of claim 1 , wherein altering the flow rate further includes changing a chemical composition of the coolant.

5. The system of claim 1 , wherein the amount is based on a temperature or change in temperature of the die arrangement.

6. The system of claim 1 , wherein the amount is based on a temperature or change in temperature of the components.

7. A hot stamping system comprising:
a controller programmed to alter a coolant inlet temperature, without altering cycle time, in an active cooling system of a die arrangement, configured to hot stamp metal into components, based on an amount of heat transferred from the components to the active cooling system such that a grain structure of the components transitions from an austenitic state to a martensitic state while the die arrangement is closed, wherein altering the coolant inlet temperature includes increasing, decreasing, or both the temperature in response to the amount exceeding a threshold amount.

8. The system of claim 7 , wherein altering the coolant inlet temperature further includes altering chemical composition of the coolant.

9. The system of claim 7 , wherein the amount is based on a temperature or change in temperature of the die arrangement.

10. The system of claim 7 , wherein the amount is based on a temperature or change in temperature of the component.

11. A monitoring method for hot stamped components, comprising:
altering by a controller a coolant flow rate or coolant inlet temperature, without altering cycle time, in an active cooling system of a die arrangement, configured to hot stamp metal into hot stamped components, in response to an amount of heat transferred from the hot stamped components to the active cooling system being indicative of an austenitic to martensitic microstructure transformation while the die arrangement is closed, wherein the altering includes adjusting the flow rate in a main inlet, side channels, or both of the active cooling system.

12. The method of claim 11 , wherein the altering further includes decreasing the flow rate or coolant inlet temperature.

13. The method of claim 11 , wherein the altering further includes increasing the flow rate or coolant inlet temperature.

14. The method of claim 11 , wherein the altering further includes changing a chemical composition of the coolant.

15. The method of claim 11 , wherein the amount is based on a temperature or change in temperature of the die arrangement.

16. The system of claim 11 , wherein the amount is based on a temperature or change in temperature of the hot stamped components.

Assignees

• Ford Motor Co
• Ford Global Tech Llc

Inventors

• Sohmshetty Raj
• Chiriac Constantin
• Hallfeldt Torsten
• Bullard Elizabeth
• Engle James

Classifications

• C21D1/673

  for die quenching · CPC title

• C21D11/005

  for cooling · CPC title

• B21C51/00 Primary

  Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F · CPC title

• B21D37/16 Primary

  Heating or cooling · CPC title

• B21D22/022

  by heating the blank or stamping associated with heat treatment (C21D takes precedence) · CPC title