Moisture-resistant electronic component and process for producing such a component

Patent metadata

Field	Value
Publication number	US-11545448-B2
Application number	US-202016924144-A
Country	US
Kind code	B2
Filing date	Jul 8, 2020
Priority date	Jul 11, 2019
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

An electronic component includes a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, wherein the first set comprises a metal plate having a front face and a back face joined to the back face of the electronic circuit; a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit; and in that the electronic component comprises: one or more layers made of organic materials stacked around the first set and the metal plate using a printed circuit-type technique and encapsulating the electronic circuit; a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate.

First claim

The invention claimed is:

1. A process for producing an electronic component comprising a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, the process comprising the following steps:
a. joining a metal plate having a front face and a back face to the back face of the electronic circuit;
b. thermally and electrically coupling the metal plate to the electronic circuit using a coupling agent between the front face of the metal plate and the back face of the electronic circuit, the coupling agent being an adhesive or a metal alloy solder;
c. stacking a plurality of layers made of thermoplastic materials around the first set and the metal plate using a printed circuit-type technique and encapsulating the electronic circuit forming an assembly;
d. laminating the assembly, by applying pressure and heat to the plurality of layers made of thermoplastic materials, the electronic circuit being thereby embedded in the thermoplastic materials;
e. producing a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate, and protecting the back face of the electronic circuit, reconnecting the back face of the electronic circuit by the thermally conductive metal surface, and forming an electric contact with the metal plate,
wherein step e. comprises a step of machining the electronic component towards the back face of the metal plate and a metallization step.

2. The production process according to claim 1 , comprising a step of producing shielding for the electronic circuit using an array of metal elements arranged at a distance from the electronic circuit so as to form a Faraday cage containing the electronic circuit.

3. The production process according to claim 2 , wherein the step of producing shielding for the electronic component comprises a step of arranging the array of metal elements on an outer lateral periphery of the electronic component.

4. The production process according to claim 2 , wherein the step of producing shielding for the electronic component comprises a step of arranging the array of metal elements on a periphery of the electronic component.

5. An electronic component comprising a first set comprising an interconnect layer and an electronic circuit having a front face and a back face, which is connected to the interconnect layer by the front face, wherein the first set comprises:
a. a metal plate having a front face and a back face joined to the back face of the electronic circuit;
b. a coupling agent between the front face of the metal plate and the back face of the electronic circuit, configured to thermally and electrically connect the metal plate to the electronic circuit, the coupling agent being an adhesive or a metal alloy solder;

and in that the electronic component is machined towards the back face of the metal plate and comprises:
c. a plurality of layers made of thermoplastic materials stacked around the first set using a printed circuit-type technique and encapsulating the electronic circuit, and uniformized by applying pressure and heat to the plurality of layers made of thermoplastic materials, the electronic circuit being thereby embedded in the thermoplastic materials;
d. a thermally conductive metal surface arranged at least partially in contact with the back face of the metal plate, thereby protecting the back face of the electronic circuit, the thermally conductive metal surface being configured to reconnect the back face of the electronic circuit, thereby forming an electric contact with the metal plate.

6. The electronic component according to claim 5 , comprising an array of metal elements arranged at a distance from the electronic circuit so as to form a Faraday cage containing the electronic circuit.

7. The electronic component according to claim 6 , wherein the array of metal elements is arranged on an outer lateral periphery of the electronic component.

8. The electronic component according to claim 6 , wherein the array of metal elements is arranged on a periphery of the electronic component.

Assignees

• Thales Sa

Inventors

• Kertesz Philippe

Classifications

• H05K3/4632

  laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets · CPC title

• H05K1/186

  manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title