Platen shield cleaning system

Patent metadata

Field	Value
Publication number	US-11545371-B2
Application number	US-202016909947-A
Country	US
Kind code	B2
Filing date	Jun 23, 2020
Priority date	Jun 23, 2020
Publication date	Jan 3, 2023
Grant date	Jan 3, 2023

Abstract

In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

First claim

What is claimed is:

1. A platen shield cleaning system comprising:
an adapter configured to be removably secured to a platen of a chemical mechanical polishing system; and
a sponge holder connected to the adapter and having an outer surface configured to receive a sponge and hold the sponge against an inner surface of a platen shield that surrounds the platen.

2. The platen shield cleaning system of claim 1 , wherein the adapter further comprises a latch configured to be removably secured to a plug extending from the platen.

3. The platen shield cleaning system of claim 1 , wherein the adapter further comprises a support flange configured to abut a top surface of the platen to prevent the adapter from rotating.

4. The platen shield cleaning system of claim 1 , further comprising a plurality of springs interposed between the adapter and the sponge holder to urge the sponge into contact with the inner surface of the platen shield.

5. The platen shield cleaning system of claim 4 , further comprising a plurality of cotter pins to hold the plurality of springs to the adapter and the sponge holder.

6. The platen shield cleaning system of claim 2 , further comprising a sponge coupled to the sponge holder.

7. The platen shield cleaning system of claim 6 , wherein the sponge is coupled to the sponge holder by a loop and hook fixture.

8. The platen shield cleaning system of claim 6 , wherein the sponge is a dry sponge.

9. The platen shield cleaning system of claim 6 , wherein the sponge is a wet sponge.

Assignees

• Applied Materials Inc

Inventors

• Gadgil Shantanu Rajiv
• Patankar Sumit Subhash
• Davis Nathan Arron
• D'Ambra Allen L

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• B24B37/27 Primary

  Work carriers · CPC title

• B08B3/003

  Cleaning involving contact with foam · CPC title