Mold for forming a radio frequency (RF) coil for a plasma processing apparatus

US11545302B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11545302-B2
Application numberUS-202016752446-A
CountryUS
Kind codeB2
Filing dateJan 24, 2020
Priority dateJan 24, 2020
Publication dateJan 3, 2023
Grant dateJan 3, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold for fabricating a radio frequency (RF) coil for use within a plasma processing apparatus, the mold comprising: a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core; and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve, wherein when portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve is configured to surround the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. 2. The mold of claim 1 , wherein the two-piece compression sleeve comprises a first portion and a second portion, which is removably attached to the first portion with one or more mechanical fasteners. 3. The mold of claim 1 , wherein the two-piece compression sleeve comprises cope and drag compression sleeves which facilitate a negative shape of the RF coil to be formed. 4. The mold of claim 1 , wherein the cylindrical inner core comprises a height between ⅝ inch and 8 inches and a diameter between 1 inch and 24 inches. 5. The mold of claim 1 , wherein the first and second helically shaped grooves each comprise a number of turns between 1 and 100 and a pitch between ⅝ inch and 2 inches. 6. A mold for fabricating a radio frequency (RF) coil for use within a plasma processing apparatus, the mold comprising: a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core; and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve, wherein when portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve is configured to surround the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil, wherein the cylindrical inner core and the two-piece compression sleeve are fabricated by three-dimensional (3D) printing a thermoplastic polymer material having a glass transition temperature above 100° C. and a compressive strength above 200 MPa. 7. The mold of claim 6 , wherein the two-piece compression sleeve comprises a first portion and a second portion, which is removably attached to the first portion with one or more mechanical fasteners. 8. The mold of claim 6 , wherein the two-piece compression sleeve comprises cope and drag compression sleeves which facilitate a negative shape of the RF coil to be formed. 9. The mold of claim 6 , wherein the cylindrical inner core comprises a height between ⅝ inch and 8 inches and a diameter between 1 inch and 24 inches. 10. The mold of claim 6 , wherein the first and second helically shaped grooves each comprise a number of turns between 1 and 100 and a pitch between ⅝ inch and 2 inches. 11. A mold for fabricating a radio frequency (RF) coil for use within a plasma processing apparatus, the mold comprising: a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core; and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve, wherein when portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve is configured to surround the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil, wherein the conductor comprises copper or aluminum. 12. The mold of claim 11 , wherein the two-piece compression sleeve comprises a first portion and a second portion, which is removably attached to the first portion with one or more mechanical fasteners. 13. The mold of claim 11 , wherein the two-piece compression sleeve comprises cope and drag compression sleeves which facilitate a negative shape of the RF coil to be formed. 14. The mold of claim 11 , wherein the cylindrical inner core comprises a height between ⅝ inch and 8 inches and a diameter between 1 inch and 24 inches. 15. The mold of claim 11 , wherein the first and second helically shaped grooves each comprise a number of turns between 1 and 100 and a pitch between ⅝ inch and 2 inches.

Assignees

Inventors

Classifications

  • using only solid materials · CPC title

  • Products made by additive manufacturing · CPC title

  • Cores · CPC title

  • H01F41/04Primary

    for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title

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Frequently asked questions

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What does patent US11545302B2 cover?
Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression s…
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H01F41/04. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 03 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).