Double anodized parts

Patent metadata

Field	Value
Publication number	US-11540408-B2
Application number	US-201615217605-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	May 29, 2012
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

First claim

What is claimed is:

1. An electronic device, comprising:
a housing comprising:
an aluminum substrate defining:
a first surface oriented in a first direction;
a second surface oriented in a second direction; and
a third surface disposed between the first and second surfaces and oriented in a third direction that is non-parallel to the first and second directions, the third surface abutting the first surface at a first chamfer edge and the second surface at a second chamfer edge; and

a protective layer defining an exterior surface overlaying the aluminum substrate, the protective layer comprising:
a primary anodization layer comprising a first portion overlaying the first surface and oriented in the first direction, and a second portion overlaying the second surface and oriented in the second direction;
a secondary anodization layer overlaying the third surface and oriented in the third direction such that a first edge of the secondary anodization layer is contiguous with the first chamfer edge and a second edge of the secondary anodization layer is contiguous with the second chamfer edge.

2. The electronic device of claim 1 , wherein the first surface is non-parallel to the second surface.

3. The electronic device of claim 1 , wherein the secondary anodization layer defines a first pore structure, and the primary anodization layer defines a second pore structure that is different from the first pore structure.

4. The electronic device of claim 1 , wherein the primary anodization layer has a primary thickness and the secondary anodization layer has a secondary thickness.

5. The electronic device of claim 4 , wherein a difference between the primary thickness and the secondary thickness is less than about 5 micrometers.

6. The electronic device of claim 1 , wherein the secondary anodization layer is transparent.

7. An electronic device, comprising:
a housing comprising:
a first metal section defining:
a first sidewall surface and a second sidewall surface that is non-parallel to the first sidewall surface; and
a mirror reflective surface disposed between the first and second sidewall surfaces, the mirror reflective surface abutting the first sidewall surface at a first chamfer edge and the second sidewall surface at a second chamfer edge, the mirror reflective surface being non-parallel to the first sidewall surface and the second sidewall surface;

a protective layer defining an exterior surface overlaying the first sidewall surface, the second sidewall surface, and the mirror reflective surface, the protective layer comprising:
a first anodization layer having a first portion disposed over the first sidewall surface and a second portion disposed over the second sidewall surface; and
a second anodization layer disposed over the mirror reflective surface, a first edge of the second anodization layer being contiguous with the first chamfer edge and a second edge of the second anodization layer being contiguous with the second chamfer edge; and

a second metal section coupled to the first metal section with a plastic coupling member.

8. The electronic device of claim 7 , wherein the first anodization layer has a first thickness, and the second anodization layer has a second thickness that differs from the first thickness by 5 micrometers or less.

9. The electronic device of claim 7 , wherein the second anodization layer has a micro-structure that allows the mirror reflective surface to be visible through the second anodization layer.

10. The electronic device of claim 7 , wherein the mirror reflective surface has a lesser roughness than the first sidewall surface or the second sidewall surface.

11. The electronic device of claim 7 , wherein the first anodization layer has a different pore density than the second anodization layer.

12. A housing capable of carrying operational components for an electronic device, the housing comprising:
a metal substrate defining:
a first surface oriented in a first direction;
a second surface oriented in a second direction;
a mirror reflective surface oriented in a third direction non-parallel to the first direction and the second direction, and positioned between and abutting the first surface at a first chamfer edge and the second surface at a second chamfer edge; and

a protective layer defining an exterior surface overlaying the metal substrate, the protective layer comprising:
a first anodization layer comprising a first portion disposed over the first surface and a second portion disposed over the second surface; and
a second anodization layer disposed over the mirror reflective surface, wherein a first edge of the second anodization layer is contiguous with the first chamfer edge and a second edge of the second anodization layer is contiguous with the second chamfer edge.

13. The housing of claim 12 , wherein the mirror reflective surface extends around a perimeter of the housing.

14. The housing of claim 12 , wherein the first surface has a curved geometry.

15. The housing of claim 14 , wherein the mirror reflective surface extends around the curved geometry.

16. The housing of claim 12 , wherein the first anodization layer has a first thickness and the secondary anodization layer has a second thickness.

17. The housing of claim 16 , wherein a difference between the primary thickness and the secondary thickness is less than about 5 micrometers.

Assignees

• Apple Inc

Inventors

• Browning Lucy Elizabeth
• Woodhull Charles B
• Kiple Bryan Patrick
• Pakula David A
• Tan Tang Yew
• Hanchak-Connors Julie
• Thornton Iii John Murray
• Johannessen Thomas
• Russell-Clarke Peter
• Tatebe Masashige
• Tan Napthaneal Y

Classifications

• B23C2226/31

  Diamond · CPC title

• Y10T29/49002

  Electrical device making · CPC title

• C25D11/12 Primary

  Anodising more than once, e.g. in different baths · CPC title

• Y10T29/47

  Burnishing · CPC title

• C25D11/246

  for sealing layers · CPC title