Electronic devices with reflective chamfer surfaces

Patent metadata

Field	Value
Publication number	US-9338908-B2
Application number	US-201514620092-A
Country	US
Kind code	B2
Filing date	Feb 11, 2015
Priority date	May 29, 2012
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.

First claim

What is claimed is:

1. A metal housing for an electronic device, the metal housing comprising:
an edge defined by a first side and a second side that meet at a chamfer;
a first anodization layer positioned on the first side and the second side, thereby defining a first interface surface between the first side and the first anodization layer, and a second interface surface between the second side and the first anodization layer; and
a second anodization layer positioned on the chamfer, thereby defining a chamfer interface surface between the chamfer and the second anodization layer, wherein the chamfer interface surface has a more even topology than each of the first interface surface and the second interface surface such that the chamfer interface surface has a higher spectral reflectivity than each of the first interface surface and the second interface surface.

2. The metal housing of claim 1 , wherein the edge is along multiple metal portions of the housing coupled together by plastic connector portions.

3. The metal housing of claim 1 , wherein the chamfer interface surface includes a plurality of peaks and troughs.

4. The metal housing of claim 1 , wherein the chamfer interface surface is characterized as having a mirror shine.

5. The metal housing of claim 1 , wherein an angle between the first anodization layer on the first side and the second anodization layer on the chamfer is consistent along the edge of the housing.

6. The metal housing of claim 1 , wherein the chamfer surface runs continuously along the edge and corners of the housing.

7. The metal housing of claim 1 , wherein the first interface surface is substantially perpendicular to the second interface surface.

8. The metal housing of claim 1 , wherein the electronic device is a portable telephone.

9. The metal housing of claim 1 , wherein the housing has a rectangular shape having two chamfer interface surfaces running along opposing edges of the housing, the edge being one of the opposing edges, and the chamfer interface surface being one of the two chamfer interface surfaces.

10. The metal housing of claim 9 , wherein the chamfer interface surface is formed uninterruptedly along a corner of the housing, the edge being one of the opposing edges, and the chamfer interface surface being one of the two chamfer interface surfaces.

11. The metal housing of claim 10 , wherein the corner is curved.

12. A housing for an electronic device, the housing comprising:
multiple metal portions coupled by at least one plastic connector portion, wherein at least one of the metal portions has a first side and a second side that meet at a chamfer,
wherein each of the first side and the second side has a first anodized layer formed thereon, thereby defining a first interface surface between the first side and the first anodized layer, and a second interface surface between the second side and the first anodized layer, and
wherein the chamfer has a second anodized layer formed thereon, thereby defining a chamfer interface surface between the chamfer and the second anodized layer, wherein the chamfer interface surface has a flatter topology than each of the first interface surface and the second interface surface such that the chamfer interface surface spectrally reflects more incident light than each of the first interface surface and the second interface surface.

13. The housing of claim 12 , wherein the chamfer interface surface runs along an edge and corner portions of the housing.

14. The housing of claim 13 , wherein the corner portions of the housing are curved.

15. The housing of claim 12 , wherein the chamfer interface surface includes a plurality of peaks and troughs.

16. The housing of claim 12 , wherein the chamfer is positioned adjacent a cover glass of the electronic device.

17. A housing for a portable electronic device, the housing comprising:
a metal portion having a back and a side wall, wherein the back and the side wall meet at a chamfer,
wherein each of the back and the side wall have a first anodized layer formed thereon such that the back and the first anodized layer define a first interface surface positioned therebetween, and the side wall and the first anodized layer define a second interface surface positioned therebetween, and
wherein the chamfer has a second anodized layer formed thereon such that the chamfer and the second anodized layer define a chamfer interface surface, wherein the chamfer interface surface is smoother than each of the first interface surface and the second interface surface such that the chamfer interface surface has a higher spectral reflectivity than each of the first interface surface and the second interface surface, wherein the first anodized layer is more opaque than the second anodized layer.

18. The housing of claim 17 , wherein the chamfer interface surface runs along three metal portions of the housing, the three metal portions coupled together by two plastic connector portions.

19. The housing of claim 18 , wherein two of the three metal portions include corners, wherein the chamfer interface surface runs continuously along at least one of the corners.

20. The housing of claim 19 , wherein the chamfer interface surface is 45 degrees with respect to each of the first interface surface and the second interface surface.

Assignees

• Apple Inc

Inventors

• Tan Napthaneal Y
• Browning Lucy Elizabeth

Classifications

• H05K5/04 Primary

  Metal casings · CPC title

• H04B1/3827

  Portable transceivers · CPC title

• C25D11/34

  of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title

• Y10T29/49826

  Assembling or joining · CPC title

• B23P17/00

  Metal-working operations, not covered by a single other subclass or another group in this subclass · CPC title