Light-emitting unit and manufacturing method of light-emitting unit

Patent metadata

Field	Value
Publication number	US-11538972-B2
Application number	US-201916726537-A
Country	US
Kind code	B2
Filing date	Dec 24, 2019
Priority date	Dec 2, 2013
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.

First claim

What is claimed is:

1. A flexible light emitting unit emitting light from an upper side and a lower side of the flexible light emitting unit comprising:
a first light transmissive substrate that comprises a first light transmissive insulator and a conductive pattern on the first light transmissive insulator, the conductive pattern comprising a first mesh pattern and a second mesh pattern, the first mesh pattern and the second mesh pattern are separated, the first mesh pattern has a first pad and the second mesh pattern has a second pad;
a second light transmissive substrate that comprises a second light transmissive insulator, the second light transmissive substrate arranged opposite to the first light transmissive substrate;
a light emitting diode, having a first electrode connected to the first pad of the first mesh pattern and a second electrode connected to the second pad of the second mesh pattern, the light emitting diode between the first light transmissive substrate and the second light transmissive substrate; and
a third light transmissive insulator in a space between the first light transmissive substrate and the second light transmissive substrate,
wherein:
the first mesh pattern includes a plurality of first lines extending in a first direction, and the second mesh pattern includes a plurality of second lines,
a first line of the plurality of first lines has a first portion which forms the first pad and a second line of the plurality of second lines has a second portion which forms the second pad,
the first pad is located between a pair of first lines of the plurality of first lines in a second direction orthogonal to the first direction,
each first line of the plurality of first lines has a first line width and each second line of the plurality of second lines has a second line width,
a width of the first bond pad is larger than the first line width and a width of the second bond pad is larger than the second line width, and
the first electrode and the second electrode are arranged side by side in the first direction.

2. A flexible light emitting unit according to claim 1 , wherein: the first bond pad and the second bond pad are facing each other.

3. A flexible light emitting unit according to claim 1 ,
wherein: a pitch of a first bump of the light emitting diode and a second bump of the light emitting diode is not more than twice an array pitch of the first lines of the plurality of first lines.

4. A flexible light emitting unit according to claim 1 , wherein: the second pad is located between a pair of second lines of the plurality of second lines in the second direction.

5. A flexible light emitting unit according to claim 1 ,
wherein:
the flexible light emitting unit comprises a plurality of the light emitting diodes, including said light emitting diode, and the plurality of the light emitting diodes are connected in series.

6. A flexible light emitting unit according to claim 1 , wherein: the first bond pad and the second bond pad are facing each other, and
a pitch of a first bump of the light emitting diode and a second bump of the light emitting diode is not more than twice an array pitch of the first lines of the plurality of first lines.

7. A flexible light emitting unit according to claim 1 , wherein:
a pitch of a first bump of the light emitting diode and a second bump of the light emitting diode is not more than twice an array pitch of the first lines of the plurality of first lines, and
the second lines of the plurality of second lines extending in the first direction and the second pad is located between a pair of second lines of the plurality of second lines in the second direction.

8. A flexible light emitting unit according to claim 1 , wherein:
the flexible light emitting unit comprises a plurality of light emitting diodes, including said light emitting diode,
a pitch of a first bump of the light emitting diode and a second bump of the light emitting diode is not more than twice an array pitch of the first lines of the plurality of first line, and
the second lines of the plurality of second lines extending in the first direction and the second pad is located between a pair of second lines of the plurality of second lines in the second direction, and
the plurality of the light emitting diodes are connected in series.

Assignees

• Toshiba Hokuto Electronics Corp
• Nichia Corp

Inventors

• Maki Keiichi

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/56

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic

• H01L2933/0066

  Electricity · mapped topic