Electrostatic chuck assembly, electrostatic chuck, and focus ring
US-2020251371-A1 · Aug 6, 2020 · US
Mounting stage, substrate processing device, and edge ring
US11538668B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11538668-B2 |
| Application number | US-201916642542-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 29, 2019 |
| Priority date | Jun 12, 2018 |
| Publication date | Dec 27, 2022 |
| Grant date | Dec 27, 2022 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
Provided is a mounting stage on which a substrate to be subjected to a plasma process is mounted. The mounting stage includes: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring. A groove is provided in at least one of the edge ring and the mounting stage, and the groove is not in communication with the supply holes.
First claim
Opening claim text (preview).
What is claimed is: 1. A mounting stage on which a substrate to be subjected to a plasma process is mounted, the mounting stage comprising: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring, wherein a groove is provided in at least one of a rear surface of the edge ring and a surface of the mounting stage on which the edge ring is disposed, wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged, wherein the plurality of grooves are not in communication with the supply holes wherein the plurality of grooves are intermittently arranged to have predetermined intervals along the circumference, and wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference. 2. The mounting stage of claim 1 , wherein the groove includes a first group of a plurality of grooves provided in the rear surface of the edge ring. 3. The mounting stage of claim 2 , wherein the groove includes a second group of a plurality of grooves provided in the surface of the mounting stage on which the edge ring is disposed. 4. The mounting stage of claim 3 , wherein the electrostatic chuck includes a first electrode configured to attract the substrate mounted on the mounting stage and a second electrode configured to attract the edge ring. 5. The mounting stage of claim 1 , wherein the groove includes a second group of a plurality of grooves provided in the surface of the mounting stage on which the edge ring is disposed. 6. The mounting stage of claim 1 , wherein the electrostatic chuck includes a first electrode configured to attract the substrate mounted on the mounting stage and a second electrode configured to attract the edge ring. 7. A substrate processing device comprising: a mounting stage on which a substrate is mounted; an edge ring disposed around the substrate; an electrostatic chuck configured to attract the edge ring and the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring, wherein a groove is provided in at least one of a rear surface of the edge ring and a surface of the mounting stage on which the edge ring is disposed, wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged, wherein the plurality of grooves are not in communication with the supply holes wherein the plurality of grooves are arranged to have predetermined intervals along the circumference, and wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference. 8. An edge ring disposed around a substrate to be subjected to a plasma process, wherein a groove is provided in a rear surface of the edge ring, wherein the groove is not in communication with supply holes through which a heat medium is supplied to a space between the edge ring and an electrostatic chuck configured to attract the edge ring, wherein the groove includes a plurality of grooves at locations corresponding to a circumference where the supply holes are arranged, wherein the plurality of grooves are arranged to have predetermined intervals along the circumference, and wherein each of the plurality of grooves and each of the supply holes are alternately arranged one by one along the circumference. 9. The mounting stage of claim 1 , wherein the groove is configured to change an impedance with respect to a high-frequency power. 10. The mounting stage of claim 1 , wherein each of the plurality of grooves has a fan shape.
Assignees
Inventors
Classifications
- H10P72/722Primary
Details of electrostatic chucks · CPC title
for drying etching · CPC title
- H01J37/32724Primary
Temperature · CPC title
Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect · CPC title
using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/26 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US11538668B2 cover?
- Provided is a mounting stage on which a substrate to be subjected to a plasma process is mounted. The mounting stage includes: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring. A groove is provided in at least one of the …
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).