Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component

Patent metadata

Field	Value
Publication number	US-11536594-B2
Application number	US-202016797632-A
Country	US
Kind code	B2
Filing date	Feb 21, 2020
Priority date	Aug 23, 2017
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.

First claim

What is claimed is:

1. A sensor component for a transmission of a motor vehicle, the sensor component comprising:
a printed circuit board having:
a first printed circuit board region, and
a second printed circuit board region, the first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove,

a sensor arranged in or on the first printed circuit board region, and
a clamping device holding the sensor to the printed circuit board, the clamping device engages around the first printed circuit board region, such that the clamping device exerts a clamping force both on the sensor arranged on a first side of the first printed circuit board region, and on a second side of the first printed circuit board region.

2. The sensor component as claimed in claim 1 , wherein the sensor includes a magnetoresistive sensor or a Hall sensor.

3. The sensor component as claimed in claim 1 , wherein the sensor is electrically connected by an electrical connection to firstly at least one conductor track and/or secondly at least one electronic component in the second printed circuit board region.

4. The sensor component as claimed in claim 3 , wherein the electrical connection includes a stamped plate.

5. The sensor component as claimed in claim 1 , wherein the second printed circuit board region has at least one through opening in the region of an electronic component connected to the sensor.

6. The sensor component as claimed in claim 1 , wherein the printed circuit board and the sensor are encapsulated by a plastic by injection molding.

7. The sensor component as claimed in claim 6 , wherein the plastic includes a thermosetting plastic or a thermoplastic.

8. The sensor component as claimed in claim 1 , which is configured for a transmission control of an automatic transmission of a motor vehicle.

9. The sensor component as claimed in claim 1 , wherein the clamping force exerted on the sensor is less than 10 N.

10. The sensor component as claimed in claim 1 , wherein the clamping device has at least one spring element for exerting the clamping force on the sensor.

11. The sensor component as claimed in claim 1 , further comprising at least one additional component arranged in or on the first printed circuit board region.

12. The sensor component as claimed in claim 11 , wherein the at least one additional component includes a ring magnet and/or a pole plate and/or a shielding plate.

13. The sensor component as claimed in claim 11 , wherein the at least one additional component is held on the first printed circuit board region by a clamping device.

14. The sensor component as claimed in claim 13 , wherein the clamping device has at least two spring elements, one spring element of which serves for exerting a clamping force on the at least one additional component and/or for aligning the at least one additional component relative to the sensor.

15. The sensor component as claimed in any of claim 11 , wherein the at least one additional component are/is arranged in the region of a through opening in the first printed circuit board region.

16. A pre-assembly arrangement for a sensor component, the pre-assembly arrangement comprises:
a printed circuit board having:
a first printed circuit board region, and
a second printed circuit board region, the first printed circuit board region is delimited from the second printed circuit board region by a milled groove;

a sensor arranged in the first printed circuit board region; and
a clamping device holding the sensor to the first printed circuit board region, such that the clamping device exerts a clamping force both on the sensor arranged on a first side of the first printed circuit board region, and on a second side of the first printed circuit board region.

17. The pre-assembly arrangement of claim 16 , wherein the sensor includes a magnetoresistive sensor or a Hall sensor.

18. A method for producing a sensor component, the method comprising:
providing a printed circuit board having a first printed circuit board region and a second printed circuit board region, wherein the first printed circuit board region is delimited from the second printed circuit board region by a milled groove;
arranging a sensor in the first printed circuit board region;
pre-fixing the sensor on the first printed circuit board region by a clamping device, the clamping device engaging around the first printed circuit board region, such that the clamping device exerts a clamping force both on the sensor arranged on a first side of the first printed circuit board region, and on a second side of the first printed circuit board region;
inserting the printed circuit board into an injection-molding tool, wherein a predefined angle between the first printed circuit board region and the second printed circuit board region is predefined during the inserting; and
encapsulating the printed circuit board with a plastic by injection molding.

Assignees

• Vitesco Technologies Germany Gmbh

Inventors

• Rietsch Jürgen
• Plach Andreas
• Bandermann Stephan
• Schmidt Thomas
• Albert Andreas
• Scharrer Klaus
• Seitz Bernd
• Menke Jens

Classifications

• H05K1/0278

  Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material · CPC title

• G01D11/30

  Supports specially adapted for an instrument; Supports specially adapted for a set of instruments · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• G01D11/245 Primary

  Housings for sensors · CPC title