Method for producing a sensor, and sensor

Patent metadata

Field	Value
Publication number	US-9649796-B2
Application number	US-201214365670-A
Country	US
Kind code	B2
Filing date	Dec 10, 2012
Priority date	Dec 17, 2011
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

The invention relates to a method for producing a sensor. In the method, a sensor element having an IC is pre-overmolded to produce a preform, wherein the preform is designed in such a way that the preform can accommodate electrical contacts for the sensor having various dimensions and/or in various positions by press fitting. The electrical contacts are pressed into holes/recesses of the preform, the connections of the IC of the sensor are connected to the electrical contacts, and the preform is inserted into an injecting mold and is overmolded to produce the finished sensor. In this way, sensors for different applications can be produced in a substantially standardized manner. The invention further relates to a sensor.

First claim

The invention claimed is:

1. A method for producing a finished sensor, the method comprising:
producing a pre-molded part by providing a pre-injection mold around a sensor element having an IC and connections, the pre-molded part having the IC of the sensor element embedded within the pre-molded part and being realized such that, as a result of an interference fit, the pre-molded part is able to receive electric contacts for the sensor with different dimensions and/or in different positions;
pressing the electric contacts into recesses/indentations of the pre-molded part after the pre-molded part is produced;
connecting the connections of the IC of the sensor element to the electric contacts after the pre-molded part is produced; and
producing the finished sensor by inserting the pre-molded part with the electric contacts into an injection molding mold and injection molding around the pre-molded part.

2. The method as claimed in claim 1 , wherein the pre-molded part is injection molded around in the injection molding mold together with a fastening part.

3. The method as claimed in claim 1 , wherein the sensor element with the IC is pre-injection molded around together with a magnet in order to obtain the pre-molded part which includes the magnet.

4. The method as claimed in claim 1 , wherein the pre-molded part is realized such that, aside from the electric contacts, it is able to receive further electric/electronic components, such as an electric resistor.

5. The method as claimed in claim 1 , wherein the pre-molded part is realized such that the assignment of the electric contacts is able to be changed.

6. The method as claimed in claim 1 , wherein the pre-molded part is provided with a removable positioning pin.

7. The method as claimed in claim 1 , wherein the connecting comprises bending the connections of the IC from a first position to a second different position in which the connections can be connected to the electric contacts.

8. The method as claimed in claim 1 , wherein the pre-molded part is realized such that sufficient space is provided so that the electrical contacts can be swapped.

9. A finished sensor including a pre-molded part which has been injection molded around and is produced as a result of pre-injection molding around a sensor element comprising an IC such that the IC is embedded within the pre-molded part and as a result of pressing electrical contacts for the sensor into the pre-molded part after the pre-molded part is produced.

Assignees

• Continental Teves Ag & Co Ohg
• Continental Automotive Gmbh

Inventors

• Panis Marc
• Viering Matthias
• Biebricher Lothar
• Déléris Robert
• Apers Leon
• Gris Marie-Noelle
• Czeh Matyas

Classifications

• B29C45/14639

  for obtaining an insulating effect, e.g. for electrical components · CPC title

• B29C45/14336 Primary

  Coating a portion of the article, e.g. the edge of the article (B29C45/14573 and B29C45/14598 take precedence) · CPC title

• B29C2045/14131

  using positioning or centering means forming part of the insert · CPC title

• G01D11/245

  Housings for sensors · CPC title

• B29K2995/0008

  Magnetic or paramagnetic · CPC title