Linear object removal method, linear object removal device, and electronic/electric apparatus component scrap processing method

Patent metadata

Field	Value
Publication number	US-11534797-B2
Application number	US-201917272913-A
Country	US
Kind code	B2
Filing date	Sep 3, 2019
Priority date	Sep 3, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters including a plurality of rods 2 extending at distances in the feed direction and a beam portion 21 for supporting the plurality of rods 2 at one ends 2a of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; and feeding a raw material containing at least wire-form objects and plate-form objects into the vibrating sieve machine 1; and vibrating the filters 3 to sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine 1.

First claim

The invention claimed is:

1. A method for removing wire-form objects, the method comprising:
arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction and a beam portion for supporting the plurality of rods at one ends of the plurality of rods, the other ends of the plurality of rods being free ends;
placing a sheet-shaped pressing member comprising a sheet-shaped material, which presses the raw material placed on the filters, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side of the raw material, the sheet-shaped material configured to directly contact and press upon the wire-form objects; and
feeding a raw material containing at least wire-form objects and plate-form objects between the filters and the sheet-shaped material, and vibrating the filters to sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine.

2. The method for removing the wire-form objects according to claim 1 , wherein each of the filters is arranged so as to be inclined such that a height of each of the filters on a downstream side in the feed direction of the raw material is higher than that on an upstream side in the feed direction of the raw material.

3. The method for removing the wire-form objects according to claim 2 , wherein each of the filters is arranged such that an inclination angle θ of each of the filters with respect to a horizontal plane is larger than 0° and 45° or less.

4. The method for removing the wire-form objects according to claim 1 ,
wherein the beam portion is made of a metal hollow or solid member comprising: an upper surface portion extending in a direction intersecting with an extending direction of the plurality of rods on the plurality of rods; a lower surface portion opposing to the upper surface portion; and two side surface portions intersecting with the upper surface portion and the lower surface portion, the two side surface portions being provided with a plurality of holes, into which the plurality of rods are inserted and fixed by welding, and
wherein the method comprises arranging each of the filters such that the upper surface portion of the beam portion possessed by one filter is arranged below the free ends of the plurality of rods possessed by the other filter adjacent to the one filter on the upstream side in the feed direction of the raw material.

5. The method for removing the wire-form objects according to claim 1 , wherein the method comprises using the filters in which a length of each of the rods is from 2 to 30 times a characteristic particle diameter of the wire-form objects.

6. The method for removing the wire-form objects according to claim 1 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

7. A method for processing electronic/electrical apparatus component scrap, the method comprising:
arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction and a beam portion for supporting the plurality of rods at one ends of the plurality of rods, the other ends of the plurality of rods being free ends;
placing a sheet-shaped pressing member comprising a sheet-shaped material, which presses the raw material placed on the filters, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side of the raw material, the sheet-shaped material configured to directly contact and press upon the wire-form objects; and
feeding a raw material containing at least substrate scrap and wire scrap between the filters and the sheet-shaped material, and vibrating the filters to sieve out wire-form objects toward an under-sieve side of the vibrating sieve machine.

8. A device for removing wire-form objects, the device comprising:
a vibrating sieve machine;
a plurality of filters arranged in the vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction and a beam portion for supporting the plurality of rods at one ends of the plurality of rods, the other ends of the plurality of rods being free ends;
a sheet-shaped pressing member comprising a sheet-shaped material, which presses the raw material placed on the filters, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side of the raw material, the sheet-shaped material configured to directly contact and press upon the wire-form objects; and
a vibrator for vibrating the filters to sieve out wire-form objects from a raw material containing at least the wire-form objects and plate-form objects toward an under-sieve side of the vibrating sieve machine.

9. The device for removing the wire-form objects according to claim 8 , wherein each of the filters is arranged so as to be inclined such that a height of each of the filters on a downstream side in the feed direction of the raw material is higher than that on an upstream side in the feed direction of the raw material.

10. The device for removing the wire-form objects according to claim 9 , wherein each of the filters is arranged such that an inclination angle θ of each of the filters with respect to a horizontal plane is larger than 0° and 45° or less.

11. The device for removing the wire-form objects according to claim 8 ,
wherein the beam portion is made of a metal hollow or solid member comprising: an upper surface portion extending in a direction intersecting with an extending direction of the plurality of rods on the plurality of rods; a lower surface portion opposing to the upper surface portion; and two side surface portions intersecting with the upper surface portion and the lower surface portion, the two side surface portions being provided with a plurality of holes, into which the plurality of rods are inserted and fixed by welding, and
wherein each of the filters is arranged such that the upper surface portion of the beam portion possessed by one filter is arranged below the free ends of the plurality of rods possessed by the other filter adjacent to the one filter on the upstream side in the feed direction of the raw material.

12. The device for removing the wire-form objects according to claim 8 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

13. The method for removing wire-form objects of claim 1 , further comprising:
providing a fall prevention tool on an end of an upper surface of the beam portion extending in a direction intersecting with an extend

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Aoki Katsushi
• TAKEDA Tsubasa

Classifications

• B07B1/36

  jigging or moving to-and-fro in more than one direction · CPC title

• B07B13/04 Primary

  according to size · CPC title

• B07B13/003 Primary

  Separation of articles by differences in their geometrical form or by difference in their physical properties, e.g. elasticity, compressibility, hardness · CPC title

• B07B1/12 Primary

  Apparatus having only parallel elements · CPC title

• B09B3/00

  Destroying solid waste or transforming solid waste into something useful or harmless · CPC title