Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap

Patent metadata

Field	Value
Publication number	US-2021039138-A1
Application number	US-201916966821-A
Country	US
Kind code	A1
Filing date	Jan 30, 2019
Priority date	Jan 31, 2018
Publication date	Feb 11, 2021
Grant date	—

Abstract

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

First claim

1 . A method for removing wire-form objects, the method comprising: arranging a filter in a vibrating sieve machine, the filter comprising a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

2 . The method for removing the wire-form objects according to claim 1 , wherein a surface of each of the plurality of rods that are brought into contact with the raw material comprises a curved surface formed for sieving out the wire-form objects under the sieve.

3 . The method for removing the wire-form objects according to claim 1 , wherein the distances between the plurality of rods and diameters of the plurality of rods are adjusted based on sizes of the plate-form objects contained in the raw material.

4 . The method for removing the wire-form objects according to claim 1 , wherein the distances between the plurality of rods are adjusted such that each of the distances is 1.2 to 6 times a characteristic particle diameter of the wire-form objects, and is narrower than a minimum short diameter of the plate-form objects.

5 . The method for removing the wire-form objects according to claim 1 , wherein the method comprises performing the sieving while disposing a pressing member for pressing the raw material onto the filter.

6 . The method for removing the wire-form objects according to claim 1 ,
wherein the vibrating sieve machine comprises a flat plate-shaped table arranged on an upstream side of the filter, and wherein the method further comprises: dispersing the raw material on an upper surface of the table by vibrating the raw material fed onto the table; and feeding the dispersed raw material from the upper surface of the table to an upper surface of the filter.

7 . The method for removing the wire-form objects according to claim 1 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

8 . A method for processing electronic/electric apparatus component scrap, the method comprising: arranging a filter in a vibrating sieve machine, the filter comprising a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

9 . The method for processing the electronic/electrical apparatus component scrap according to claim 8 , wherein the wire-form scrap contains coated wires.

10 . A device for removing wire-form objects, the device comprising:
a vibrating sieve machine; a filter comprising a plurality of rods extending at distances in a feed direction of a raw material disposed in the vibrating sieve machine; and a vibration applying unit for applying vibration to the filter, wherein a raw material which comprises at least wire-form objects and plate-form objects is placed onto the filter, and the filter is vibrated to sieve out the wire-form objects under a sieve.

11 . The device for removing the wire-form objects according to claim 10 , further comprising a pressing member that can press the raw material placed on the filter from above.

12 . The device for removing the wire-form objects according to claim 11 , wherein the pressing member has elasticity.

13 . The device for removing the wire-form objects according to claim 11 , wherein the pressing member has a fixed end that is fixed to the vibrating sieve machine on a feed side of the raw material, and has a free end that is not fixed to the vibrating sieve machine on a discharge side of the raw material.

14 . The device for removing the wire-form objects according to claim 13 , wherein the fixed end is fixed to an upper portion of a feed port for feeding the raw material to an upper surface of the filter, and the pressing member is suspended from the feed side toward the discharge side of the raw material with the fixed end as a starting point, and wherein the free end of the pressing member is movable in an up-down direction while pressing the raw material against the upper surface of the filter on the discharge side of the raw material.

15 . The device for removing the wire-form objects according to claim 10 , wherein the vibrating sieve machine comprises a flat plate-shaped table arranged on an upstream side of the filter, and wherein the raw material fed onto an upper surface of the table is vibrated to disperse the raw material on the upper surface of the table, and the dispersed raw material is fed from the upper surface of the table to the upper surface of the filter.

16 . The device for removing the wire-form objects according to claim 10 , wherein the raw material is electronic/electrical apparatus component scrap, and wherein the plate-form objects contain substrate scrap, and the wire-form objects contain wire scrap.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Aoki Katsushi
• Sasaoka Hidetoshi

Classifications

• B09B3/35

  Shredding, crushing or cutting · CPC title

• B07B1/40 Primary

  Resonant vibration screens · CPC title

• B07B1/12

  Apparatus having only parallel elements · CPC title

• B07B13/003 Primary

  Separation of articles by differences in their geometrical form or by difference in their physical properties, e.g. elasticity, compressibility, hardness · CPC title

• B07B1/4609

  constructional details of screening surfaces or meshes · CPC title