Multi-zone heater model-based control in semiconductor manufacturing

Patent metadata

Field	Value
Publication number	US-11533783-B2
Application number	US-201916515993-A
Country	US
Kind code	B2
Filing date	Jul 18, 2019
Priority date	Jul 18, 2019
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A plurality of heating zones in a substrate support assembly in a chamber is independently controlled. Temperature feedback from a plurality of temperature detectors is provided as a first input to a process control algorithm, which may be a closed-loop algorithm. A second input to the process control algorithm is targeted values of heater temperature for one or more heating zones, as calculated using a model. Targeted values of heater power needed for achieving the targeted values of heater temperature for the one or more heating zones is calculated. Chamber hardware is controlled to match the targeted value of heater temperature that is correlated with the wafer characteristics corresponding to the current optimum values of the one or more process parameters.

First claim

What is claimed is:

1. A method comprising operations of:
collecting temperature feedback from a plurality of temperature detectors, each of the plurality of temperature detectors being placed in a corresponding heating zone of a plurality of heating zones of a substrate support assembly supporting a wafer;
providing data representing the temperature feedback as a first input to a process control algorithm that is part of a model-based control architecture;
providing, as a second input to the process control algorithm, targeted values of heater temperature for one or more heating zones of the plurality of heating zones, as calculated using an inverse model configured to calculate a targeted value of heater temperature for a particular heating zone of one or more of the heating zones based on wafer etch amount and wafer temperature corresponding to current optimum values of one or more process parameters, wherein the model-based control architecture also comprises an inverse heat-exchanger sub-model that correlates the targeted values of the heater temperature with flow of coolant supplied by the heat-exchanger;
calculating targeted values of heater power for achieving the targeted values of heater temperature for one or more of the heating zones, wherein the calculation is performed, by a processor running the process control algorithm, based on the first input and the second input; and
controlling, by the model-based control architecture, chamber hardware of a processing chamber comprising the substrate support assembly to match the targeted values of heater temperature for one or more of the heating zones while fabricating the wafer in the process chamber.

2. The method of claim 1 , wherein the plurality of temperature detectors comprises a plurality of resistance temperature detectors (RTDs).

3. The method of claim 1 , wherein process parameters used by the inverse model include one or more of: temperature of a showerhead, chamber pressure, or, distance between the showerhead and the substrate support assembly.

4. The method of claim 3 , wherein the inverse model takes into account wafer characteristics including wafer material and layer being etched.

5. The method of claim 3 , wherein process parameters used by the inverse model further include one or more of: chamber body temperature, heat-exchanger temperature, lift-pin height, or, process gas.

6. The method of claim 1 , wherein the process control algorithm is a closed-loop algorithm where the operations of collecting the temperature feedback, providing data representing the temperature feedback, providing targeted values of the heater temperature, calculating targeted values of the heater power, and controlling chamber hardware are repeated.

7. The method of claim 1 , wherein the operation of controlling the chamber hardware comprises:
controlling heater electronics to deliver the calculated targeted values of heater power to one or more of the heating zones.

8. The method of claim 7 , wherein the operation of controlling the chamber hardware further comprises:
controlling heat-exchanger temperature to achieve targeted values of heater temperature for one or more of the heating zones.

9. The method of claim 1 , wherein the inverse model is trained with historical chamber data using a machine-learning algorithm.

10. The method of claim 1 , wherein each of the plurality of heating zones comprises one or more heaters.

11. The method of claim 1 , wherein the substrate support assembly has a plurality of regions, each region having a corresponding independently-controllable plurality of heating zones.

12. A system comprising:
a plurality of temperature detectors, each of the plurality of temperature detectors being placed in a corresponding heating zone of a plurality of heating zones of a substrate support assembly configured to support a wafer;
a processor that is to execute a process control algorithm that is part of a model-based control architecture, the processor to:
receive temperature feedback data from the plurality of temperature detectors;
provide the temperature feedback data as a first input to the process control algorithm;
calculate, using an inverse model stored in a server, targeted values of heater temperature for one or more of the heating zones of the plurality of heating zones, wherein the inverse model is configured to calculate a targeted value of heater temperature for a particular heating zone of one or more of the heating zones based on wafer etch amount and wafer temperature corresponding to current optimum values of one or more process parameters;
provide, as a second input to the process control algorithm, the targeted values of heater temperature for the one or more heating zones, as calculated by the inverse model, wherein the model-based control architecture also comprises an inverse heat-exchanger sub-model that correlates the targeted values of the heater temperature with flow of coolant supplied by the heat-exchanger;
calculate targeted values of heater power for achieving the targeted values of heater temperature for the one or more heating zones, based on the first input and the second input; and
calculate, by the model-based control architecture, amounts by which chamber hardware of a processing chamber comprising the substrate support assembly is to be adjusted to match the targeted values of heater temperature for one or more of the heating zones while fabricating the wafer in the processing chamber.

13. The system of claim 12 , wherein the plurality of temperature detectors comprises a plurality of resistance temperature detectors (RTDs).

14. The system of claim 12 , wherein process parameters used by the inverse model includes one or more of: temperature of a showerhead, chamber pressure, or, distance between the showerhead and the substrate support assembly.

15. The system of claim 14 , wherein process parameters used by the inverse model further includes one or more of: chamber body temperature, heat-exchanger temperature, lift-pin height, or, process gas.

16. The system of claim 12 , wherein the chamber hardware comprises:
heater electronics that delivers the calculated targeted values of heater power to the one or more heating zones.

17. The system of claim 16 , wherein the chamber hardware further comprises:
heat-exchanger temperature controller that helps in achieving targeted values of heater temperature for the one or more heating zones.

18. The system of claim 12 , wherein the process control algorithm is a closed-loop algorithm.

Assignees

• Applied Materials Inc

Inventors

• Cimino Mauro
• Kaluarachchi Don Channa
• Phi Son
• Vishnuprasad Ramyashree
• Lubomirsky Dmitry

Classifications

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• G01K7/183

  characterised by the use of the resistive element · CPC title

• H01J37/32724 Primary

  Temperature · CPC title

• H05B1/0233 Primary

  for semiconductors manufacturing · CPC title

• H01J2237/334

  Etching · CPC title