Modified colloidal silica and method for producing the same, and polishing agent using the same

Patent metadata

Field	Value
Publication number	US-11530335-B2
Application number	US-201916448992-A
Country	US
Kind code	B2
Filing date	Jun 21, 2019
Priority date	Jan 19, 2015
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica.Modified colloidal silica, being obtained by modifying raw colloidal silica, whereinthe raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.

First claim

The invention claimed is:

1. A method for producing modified colloidal silica, comprising the steps of:
distilling off an organic solvent coexisting with colloidal silica in colloidal silica having an organic solvent concentration of 1% by mass or more under a condition of pH 7 or more so that a residual organic solvent concentration is less than 1% by mass to obtain raw colloidal silica;
lowering a viscosity of the raw colloidal silica by adding an alkaline solution to the raw colloidal silica; and
modifying the raw colloidal silica to obtain modified colloidal silica;
wherein the modifying comprises:
a first reaction step of heating the raw colloidal silica in the presence of a silane coupling agent having a functional group chemically convertible to a sulfonic acid group to obtain a reactant, wherein a mixture of the silane coupling agent and a hydrophilic solvent is added to the raw colloidal silica; and
a second reaction step of treating the reactant to convert the functional group to a sulfonic acid group.

2. The method for producing modified colloidal silica according to claim 1 , wherein the functional group is a mercapto group.

3. A method for producing modified colloidal silica according to claim 1 , wherein the treatment is an oxidation treatment using an oxidizing agent.

4. The method for producing modified colloidal silica according to claim 3 , wherein an addition amount of the oxidizing agent in the oxidation treatment is 3 to 5 mol times relative to an addition amount of the silane coupling agent, and a residual oxidizing agent concentration in the obtained modified colloidal silica is 1000 ppm by mass or less.

5. The method for producing modified colloidal silica according to claim 3 , wherein the oxidizing agent is hydrogen peroxide.

6. The method for producing modified colloidal silica according to claim 1 , wherein the first reaction step is performed under a condition that a temperature condition of 90° C. or more is continued for 30 minutes or more.

7. The method for producing modified colloidal silica according to claim 1 , wherein the alkaline solution is ammonia water.

Assignees

• Fujimi Inc

Inventors

• Ashitaka Keiji
• Tsubota Shogo

Classifications

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10W20/092

  by smoothing the dielectric parts · CPC title

• B24B37/00 Primary

  Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title