System for manufacturing an inductor core

Patent metadata

Field	Value
Publication number	US-11529803-B2
Application number	US-201916711175-A
Country	US
Kind code	B2
Filing date	Dec 11, 2019
Priority date	Sep 7, 2016
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A system includes a magnetic material supply for regulating a magnetic material flow rate of a magnetic material and a binder material supply for regulating a binder material flow rate of a binder material. A nozzle is configured for depositing a deposition mixture of the magnetic material and the binder material on a surface and a preheater is configured to preheat the deposition mixture before depositing on the surface. A controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater. The controller is configured to receive an inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core, move the nozzle to one or more deposition locations, and adjust the magnetic material flow rate to the binder material flow rate to achieve a deposition mixture having a desired magnetic permeability at the deposition locations.

First claim

The invention claimed is:

1. A system, comprising:
a magnetic material supply comprising a magnetic material supply valve for regulating a magnetic material flow rate of a magnetic material;
a binder material supply comprising a binder material supply valve for regulating a binder material flow rate of a binder material;
a nozzle fluidly coupled to the magnetic material supply and the binder material supply for depositing a deposition mixture of the magnetic material and the binder material on a surface;
a preheater configured to preheat the magnetic material and the binder material before the magnetic material and the binder material are deposited on the surface; and
a master computing device that comprises a controller and a computing device, the computing device comprising a processor and a memory accessible by the processor, wherein the memory is configured to store an inductor core design file; wherein the controller is in operative communication with the magnetic material supply, the binder material supply, and the preheater, the controller being configured to:
receive the inductor core design file that represents a geometry and a magnetic permeability distribution of an inductor core;
move the nozzle to a first deposition location;
determine a first magnetic permeability of the inductor core at the first deposition location based on the inductor core design file;
determine a first ratio of the magnetic material flow rate to the binder material flow rate to provide the deposition mixture having the first magnetic permeability; and
regulate the magnetic material supply and the binder material supply to deposit the deposition mixture having the first ratio at the first deposition location.

2. The system of claim 1 , wherein the inductor core design file comprises at least one of a computer-aided design (CAD) file, an OBJ file, a stereolithography (STL) file, a drawing exchange format (DXF) file, or an additive manufacturing file format (AMF) file.

3. The system of claim 1 , further comprising:
a drive mechanism configured to facilitate relative movement between the nozzle and the surface.

4. The system of claim 3 , further comprising:
an XY table that is movable relative to the nozzle, wherein the drive mechanism is mechanically coupled to the XY table and the controller is in operative communication with the drive mechanism for selectively moving the XY table.

5. The system of claim 1 , wherein the preheater comprises at least one of a coil, a light source, a resistive element, or a laser.

6. The system of claim 1 , wherein the preheater is operably coupled to the nozzle.

7. The system of claim 1 , wherein the magnetic material comprises magnetic powder and the binder material comprises epoxy.

8. The system of claim 1 , wherein the controller is further configured to:
move the nozzle to a second deposition location;
determine a second magnetic permeability of the inductor core at the second deposition location based on the inductor core design file;
determine a second ratio of the magnetic material flow rate to the binder material flow rate to achieve the deposition mixture having the second magnetic permeability; and
regulate the magnetic material supply and the binder material supply to deposit the deposition mixture having the second ratio at the second deposition location.

9. The system of claim 8 , wherein the first deposition location is closer to an edge of the inductor core relative to the second deposition location and the second deposition location is closer to a center of the inductor core relative to the first deposition location, and wherein the first magnetic permeability at the first deposition location is higher than the second magnetic permeability at the second deposition location.

10. The system of claim 1 , wherein the inductor core comprises:
a first layer having a first surface, a second surface, and a first recessed pattern extending from the second surface of the first layer toward the first surface of the first layer;
a second layer having a third surface, a fourth surface, a second recessed pattern extending from the third surface of the second layer toward the fourth surface of the second layer, and a third recessed pattern extending from the fourth surface of the second layer toward the third surface of the second layer; and
a third layer having a fifth surface, a sixth surface, and a fourth recessed pattern extending from the fifth surface of the third layer toward the sixth surface of the third layer, wherein the second layer is disposed between the first and third layers.

11. The system of claim 10 , wherein the second layer is disposed between the first and third layers such that the second surface of the first layer faces the third surface of the second layer and the fourth surface of the second layer faces the fifth surface of the third layer, wherein the first and second recessed patterns correspond to one another and are configured to receive a coil, and wherein the first, second, and third layers have non-uniform magnetic permeabilities, and wherein the first and second recessed patterns have semi-circular cross-sections, and wherein the first and second recessed patterns are configured to combine to form a passage having a circular cross section when the second surface of the first layer is coupled to the third surface of the second layer.

Assignees

• Gen Electric

Inventors

• Wang Ruxi
• Shah Manoj Ramprasad
• Ramabhadran Ramanujam
• Yang Yanzhe

Classifications

• B29C70/882 Primary

  partly or totally electrically conductive, e.g. for EMI shielding (conductive floors or floor coverings H05F3/025; EMI shielding in general H05K9/00) · CPC title

• H01F27/22

  Cooling by heat conduction through solid or powdered fillings · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• H01F41/0246

  Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title