Electronic device having first and second component carrier parts with cut-outs therein and adhesively joined to form a cavity that supports an electronic component therein

Patent metadata

Field	Value
Publication number	US-11527807-B2
Application number	US-201816977115-A
Country	US
Kind code	B2
Filing date	Mar 7, 2018
Priority date	Mar 7, 2018
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

First claim

The invention claimed is:

1. An electronic device, comprising:
an electronic component; and
a component carrier in which the electronic component is embedded,
wherein the component carrier comprises a first component carrier part having a first cut-out portion, and wherein the component carrier comprises a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component,
wherein an electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion,
wherein the first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component,
wherein the component carrier comprises a first adhesive layer between the first component carrier part and the electronic component,
wherein the component carrier comprises a second adhesive layer between the second component carrier part and the electronic component,
wherein the first adhesive layer and/or the second adhesive layer comprise a no-flow prepreg material or a low-flow prepreg material.

2. The electronic device according to claim 1 , wherein the electronic component comprises an RF substrate.

3. The electronic device according to claim 2 , wherein the RF substrate comprises a first electrically conductive layer structure on a first main surface and a second electrically conductive layer structure on a second main surface opposite from the first main surface.

4. The electronic device according to claim 1 , wherein the electronic component is a stripline.

5. The electronic device according to claim 1 , wherein the first cavity and the second cavity are filled with air.

6. The electronic device according to claim 1 , wherein the surface of the first cut-out portion and the surface of the second cut-out portion are completely covered by electrically conductive material.

7. The electronic device according to claim 1 , wherein the first cavity comprises a depth in the range of 0.1 mm to 2 mm, and wherein the second cavity comprises a depth in the range of 0.1 mm to 2 mm.

8. The electronic device according to claim 1 , wherein the component carrier comprises a via.

9. The electronic device according to claim 1 , wherein the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure.

10. The electronic device according to claim 9 ,
wherein the electronic component is mounted on or embedded in the no-flow prepreg material or the low-flow prepreg material.

11. The electronic device according to claim 9 , wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten.

12. The electronic device according to claim 9 , wherein the at least one of the electrically insulating layer structure comprises at least one of the group consisting of reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide.

13. The electronic device according to claim 1 , wherein the first component carrier part has a dimension that is shorter than a respective dimension of the second component carrier part.

14. The electronic device according to claim 1 , wherein the component carrier is configured as one of the group consisting of a printed circuit board, and a substrate.

15. The electronic device according to claim 1 , wherein the component carrier is configured as a laminate-type component carrier.

16. A method of manufacturing an electronic device, the method comprising the steps of:
providing a first component carrier part having a first cut-out portion;
providing a second component carrier part having a second cut-out portion;
providing an electrically conductive material on the surface of the first cut-out portion and on the surface of the second cut-out portion;
arranging an electronic component between the first component carrier part and the second component carrier part, such that the first cut-out portion and the second cut-out portion face opposite main surfaces of the electronic component;
providing a first adhesive layer between the first component carrier part and the electronic component;
providing a second adhesive layer between the second component carrier part and the electronic component;
wherein the first adhesive layer and/or the second adhesive layer comprise a no-flow prepreg material or a low-flow prepreg material; and
connecting the first component carrier part and the second component carrier part with each other to form a component carrier embedding the electronic component,
wherein the first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

17. The method according to claim 16 , wherein the step of connecting comprises pressing the first component carrier part and the second component carrier part against each other.

18. The method according to claim 16 , wherein the first adhesive layer comprises a cut-out portion corresponding to the first cut-out portion and/or wherein the second adhesive layer comprises a cut-out portion corresponding to the second cut-out portion.

Assignees

• At & S Austria Tech & Systemtechnik Ag

Inventors

• Gentili Fabrizio
• Sattler Sebastian
• Bösch Wolfgang
• Schlaffer Erich
• Kastelic Markus
• Reitmaier Bernhard

Classifications

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title

• H05K1/0224

  Patterned shielding planes, ground planes or power planes (H05K1/0253 takes precedence) · CPC title

• H05K1/0218

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title

• H01P3/087 Primary

  Suspended triplate lines · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title