Wiring board, electronic device, and electronic module

Patent metadata

Field	Value
Publication number	US-10157753-B2
Application number	US-201515513704-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Sep 26, 2014
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

A wiring board ( 1 ) includes an insulating substrate ( 11 ) having a cutout ( 12 ) opened in a main surface and a side surface of the insulating substrate ( 11 ), and an inner electrode ( 13 ) formed on an inner surface of the cutout ( 12 ). The inner electrode ( 13 ) includes a plurality of metal layers. The inner electrode ( 13 ) includes, as an intermediate layer, at least one metal layer ( 17 b ) selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer ( 17 a ). The metal layer ( 17 b ) is exposed at an outer edge portion of the inner electrode ( 13 ).

First claim

The invention claimed is:

1. A wiring board, comprising:
an insulating substrate having a cutout opened in a main surface and a side surface; and
an inner electrode arranged on an inner surface of the cutout, the inner electrode including a plurality of metal layers,
wherein the inner electrode includes, as an intermediate layer, at least one metal layer selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer, and when viewed in a direction perpendicular to the main surface of the insulating substrate, a part of the at least one metal layer extends from an outer edge portion of the gold layer adjacent to the side surface of the insulating substrate toward the side surface of the insulating substrate.

2. The wiring board according to claim 1 , wherein
an outer edge portion of the inner electrode adjacent to the side surface of the insulating substrate extends along an opening of the cutout adjacent to the side surface of the insulating substrate.

3. The wiring board according to claim 1 , wherein the cutout has a curved inner surface.

4. The wiring board according to claim 1 , wherein the cutout has a shape corresponding to a portion obtained by dividing a partial square frustum, and the cutout has an opening width at the main surface greater than a bottom width.

5. An electronic device, comprising:
the wiring board according to claim 1 ; and
an electronic component mounted on the wiring board and electrically connected to the inner electrode.

6. An electronic module, comprising:
a module substrate including a connection pad on a main surface of the module substrate; and
the electronic device according to claim 5 including the inner electrode connected to the connection pad with solder.

7. The wiring board according to claim 2 , wherein
the cutout has a curved inner surface.

8. The wiring board according to claim 2 , wherein
the cutout has a shape corresponding to a portion obtained by dividing a partial square frustum, and the cutout has an opening width at the main surface greater than a bottom width.

Assignees

• Kyocera Corp

Inventors

• Morita Yukio
• Sugimoto Kenji

Classifications

• H01P3/087

  Suspended triplate lines · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title