Grinding apparatus

Patent metadata

Field	Value
Publication number	US-11524386-B2
Application number	US-202016829282-A
Country	US
Kind code	B2
Filing date	Mar 25, 2020
Priority date	Apr 5, 2019
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

First claim

What is claimed is:

1. A grinding apparatus comprising:
a holding unit including a chuck table having a holding surface for holding a wafer, the chuck table being rotatable about a rotation axis passing through a center of the holding surface;
a grinding unit including a spindle having a rotation axis and a grinding wheel mounted at a lower end of the spindle, the grinding wheel having a plurality of abrasive members arranged annularly, wherein when the spindle is rotated to thereby rotate the grinding wheel, the wafer held on the chuck table is ground by the abrasive members of the grinding wheel being rotated;
an inclination adjusting unit for adjusting an inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle; and
a touch panel, wherein:
the abrasive members are adapted to grind the wafer held on the chuck table in a grinding area as a radial area ranging from the center of the holding surface to an outer circumference thereof, and
the touch panel is adapted to display a target shape input field for inputting information regarding a target sectional shape of the wafer and a present shape input field for inputting information regarding a present sectional shape of the wafer ground in a condition where the inclination of the rotation axis of the chuck table has not yet been changed, wherein the present shape input field includes at least a first present height input field and a second present height input field, and the target shape input field includes at least a first target height input field and a second target height input field, and further wherein the first and second target height input fields are configured and arranged to receive inputs of equal heights as well as inputs of unequal heights;

the grinding apparatus further comprising:
a control portion for comparing the information regarding the target sectional shape of the wafer as input into the target shape input field with the information regarding the present sectional shape of the wafer as input into the present shape input field and then controlling the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer, and

wherein the inclination adjusting unit comprises:
at least three supporting portions configured and arranged for supporting the chuck table,
wherein the at least three supporting portions includes at least two moveable supporting portions that each include:
a threaded rotatable shaft,
an internally threaded receiving portion that is configured and arranged to receive the threaded rotatable shaft, and
a sensor seated within the internally threaded receiving portion for detecting a position of the threaded rotatable shaft received within the internally threaded receiving portion.

2. The grinding apparatus according to claim 1 , wherein:
the holding unit includes a plurality of holding units each having the chuck table,
the grinding apparatus further comprising:
a positioning unit for moving one of the plurality of holding units to a grinding position where the wafer is ground by the grinding unit, wherein:
the touch panel is adapted to further display a selecting portion for use in selecting one of the plurality of holding units, and
the control portion is adapted to change the inclination of the rotation axis of the chuck table in the holding unit selected by using the selecting portion.

3. The grinding apparatus according to claim 1 , wherein:
information regarding the sectional shape of the wafer is input into the target shape input field and the present shape input field every time processing conditions are set in processing the wafer.

4. The grinding apparatus according to claim 1 , wherein:
the first present height input field and the first target height input field both correspond to heights at a center of the wafer; and
the second present height input field and the second target height input field both correspond to heights at an outer peripheral portion of the wafer.

5. The grinding apparatus according to claim 1 , wherein:
the present shape input field also includes a third present height input field; and
the target shape input field includes a third target height input field.

6. The grinding apparatus according to claim 4 , wherein:
the present shape input field also includes a third present height input field, and the third present height input field corresponds to a height at an intermediate portion of the wafer, between the center of the wafer and the outer peripheral portion of the wafer; and
the target shape input field includes a third target height input field, and the third target height input field corresponds to a height at an intermediate portion of the wafer, between the center of the wafer and the outer peripheral portion of the wafer.

7. The grinding apparatus according to claim 1 , wherein the at least three supporting portions also includes a fixed supporting portion that includes a fixed shaft.

8. The grinding apparatus according to claim 1 , wherein the internally threaded receiving portion is fixed to a lower surface of a frame of the chuck table.

Assignees

• Disco Corp

Inventors

• Matsubara Souichi
• Kubo Tetsuo
• Yamashita Shinji

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/02

  according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent (B24B49/12 takes precedence) · CPC title

• B24B41/005

  Feeding or manipulating devices specially adapted to grinding machines (feeding, loading or unloading work specially adapted to lapping machines B24B37/345) · CPC title

• B24B51/00

  Arrangements for automatic control of a series of individual steps in grinding a workpiece (if applicable to other machine tools, G05B takes precedence) · CPC title

• B24B1/00

  Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title