Method for fabrication of a soft-matter printed circuit board

Patent metadata

Field	Value
Publication number	US-11523514-B2
Application number	US-202016895742-A
Country	US
Kind code	B2
Filing date	Jun 8, 2020
Priority date	Jan 9, 2018
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

First claim

We claim:

1. A method for fabricating a soft-matter printed circuit board comprising:
providing a layer of an elastomeric substance;
patterning one or more openings in the elastomeric substance;
placing one or more solid state devices in the one or more openings;
coating the layer of the elastomeric substance with a layer of an anisotropically conductive substance;
coating the layer of the anisotropically conductive substance with a layer of liquid metal;
etching a one or more circuit paths in the layer of liquid metal; and
coating the layer of liquid metal with a sealing layer;
wherein the anisotropically conductive substance comprises a plurality of ferromagnetic microspheres forming vertically aligned columns in a cured elastomer.

2. The method of claim 1 wherein the layer of the elastomeric substance is cured polydimethylsiloxane.

3. The method of claim 1 wherein the layer of the anisotropically conductive substance is formed by:
coating the ferromagnetic microspheres with a liquid metal;
suspending the liquid metal-coated ferromagnetic microspheres in a liquid elastomer;
coating the layer of the elastomeric substance with the liquid elastomer; and
curing the liquid elastomer in the presence of a magnetic field such that the lines of the magnetic field extend through the thickness of the layer.

4. The method of claim 1 wherein the layer of liquid metal is eGaIn.

5. The method of claim 1 wherein etching the circuit in the layer of liquid metal comprises etching circuit paths such that the circuit paths align with appropriate contacts on the solid state devices and wherein the circuit paths and contacts are separated by the layer of an anisotropically conductive substance.

6. The method of claim 1 wherein the layer of sealing material is PDMS.

7. The method of claim 1 wherein the one or more circuit paths are etched in the layer of liquid metal using UV laser micromachining.

8. The method of claim 1 wherein the vertically-aligned columns of ferromagnetic microspheres creates vias between the circuit paths.

9. The method of claim 2 wherein the layer of elastomeric substance is disposed on a glass plate.

10. The method of claim 3 wherein the ferromagnetic microspheres are coated with silver.

11. The method of claim 3 wherein the ferromagnetic microspheres are coated with liquid metal.

12. The method of claim 9 wherein the one or more solid state devices are placed having a board-side of the one or more solid state devices facing the glass plate.

13. The method of claim 12 further comprising:
coating the layer of elastomeric substance opposite the glass plate with a second sealing layer comprising an elastomeric substance.

14. The method of claim 12 further comprising:
removing the layer of the elastomeric substance from the glass plate to expose the board-side of the one or more solid state devices.

15. The method of claim 14 wherein coating the layer of elastomeric substance with the layer of the anisotropically conductive substance comprises covering the board-side of the one or more solid state devices with the anisotropically conductive substance.

Assignees

• Univ Carnegie Mellon

Inventors

• Majidi Carmel
• Lu Tong
• Markvicka Eric J

Classifications

• H05K2203/107

  Using laser light · CPC title

• A61B2562/164

  the sensor is mounted in or on a conformable substrate or carrier · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K3/027

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title