Method of forming metallic pattern on polymer substrate
US-2015376809-A1 · Dec 31, 2015 · US
Bathless metal-composite electroplating
US11519091B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11519091-B2 |
| Application number | US-202016843202-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 8, 2020 |
| Priority date | Apr 9, 2019 |
| Publication date | Dec 6, 2022 |
| Grant date | Dec 6, 2022 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic membrane is applied to the composite mixture. An anode, with oxidizing properties, is applied to the membrane. A current is applied to the bathless setup. Upon removing the current and composite mixture from the cathode, a metal-based composite coating remains on the cathode.
First claim
Opening claim text (preview).
What is claimed is: 1. A metal-composite electroplated coating prepared by the process comprising the steps of: applying a composite mixture to a cathode, wherein the cathode is a conductive material, and wherein the composite mixture comprises a metal salt, an acid, and a composite material; applying a membrane to the composite mixture, wherein the membrane is hydrophilic; applying an anode to the membrane, wherein the anode is a material with oxidizing properties; and applying a current to the anode and the cathode, wherein the composite material has a diameter greater than 20 μm.
Assignees
Inventors
Classifications
- C25D5/02Primary
Electroplating of selected surface areas · CPC title
Heavy metal or aluminum or compound thereof · CPC title
Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title
- C09K11/70Primary
containing phosphorus · CPC title
Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles · CPC title
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Frequently asked questions
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- What does patent US11519091B2 cover?
- A bathless plating for a conductive material with composite particles or with high surface coverage. The setup for the bathless electro-plating includes a cathode, a composite mixture, a membrane, and an anode. The cathode is a conductive material. The composite mixture comprises a metal salt, an acid, and a composite material. The composite mixture is applied to the cathode. A hydrophilic memb…
- Who is the assignee on this patent?
- Us Navy, Us Navy
- What technology area does this patent fall under?
- Primary CPC classification C25D5/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).