Composition for forming silica layer, manufacturing method for silica layer, and silica layer

Patent metadata

Field	Value
Publication number	US-11518909-B2
Application number	US-201816645343-A
Country	US
Kind code	B2
Filing date	Feb 13, 2018
Priority date	Oct 13, 2017
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.

First claim

What is claimed is:

1. A composition for forming a silica layer, the composition comprising:
a silicon-containing polymer and a solvent,
wherein the silicon-containing polymer comprises an organic-inorganic polysiloxazane;
wherein the composition is configured such that, when the composition is coated on a pattern formed on a substrate to form a silica layer, the silica layer satisfies Relation 1:

b
a

>

(

t
/
2

)

h

[

Relation
⁢

⁢
1

]

wherein, in Relation 1,
a is an etch rate on an upper portion of the pattern,
b is an etch rate inside the pattern,
h is a layer thickness on the upper portion of the pattern, and
t is a length of the pattern; and

wherein the organic-inorganic polysiloxazane is obtained by reacting a hydrogenated polysiloxazane with hexamethyldisilazane (HMDS).

2. The composition of claim 1 , wherein the silicon-containing polymer further comprises an organic-inorganic polysilazane.

3. The composition of claim 1 , wherein in Relation 1, a and b are etch rates obtained by a wet etch method.

4. The composition of claim 1 , wherein the composition is configured such that, when the composition is coated on the pattern formed on the substrate to form the silica layer, the silica layer satisfies Relation 2:

b
a

>
3

[

Relation
⁢

⁢
2

]

wherein, in Relation 2,
a and b are the same as defined in Relation 1.

5. The composition of claim 2 , wherein the organic-inorganic polysilazane comprises a moiety represented by Chemical Formula 1 and the organic-inorganic polysiloxazane comprises a moiety represented by Chemical Formula 2:

wherein, in Chemical Formula 1,
R1 to R3 are independently hydrogen, a substituted or unsubstituted C1to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted alkoxy group, a carboxyl group, an aldehyde group, a hydroxy group, or a combination thereof, and
“*” refers to a linking point,

wherein, in Chemical Formula 2,
R 4 to R 7 are independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted alkoxy group, a carboxyl group, an aldehyde group, a hydroxy group, or a combination thereof, and
“*” refers to a linking point.

6. The composition of claim 1 , wherein the silicon-containing polymer is included in an amount of 0.1 to 30 wt % based on a total amount of the composition for forming the silica layer.

7. A silica layer comprising a silica component obtained by curing the composition for forming the silica layer of claim 1 .

8. An electronic device comprising the silica layer of claim 7 .

9. A composition for forming a silica layer, the composition comprising:
a silicon-containing polymer and a solvent,
wherein the silicon-containing polymer comprises an organic-inorganic polysiloxazane;
wherein the organic-inorganic polysiloxazane is obtained by reacting a hydrogenated polysiloxazane with hexamethyldisilazane (HMDS); and
wherein the organic-inorganic polysiloxazane comprises a moiety represented by

wherein, in Chemical Formula 2,
R 4 to R 7 are independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted alkoxy group, a carboxyl group, an aldehyde group, a hydroxy group, or a combination thereof, and
“*” refers to a linking point.

10. The composition of claim 9 , wherein the silicon-containing polymer is included in an amount of 0.1 to 30 wt % based on a total amount of the composition for forming the silica layer.

11. A silica layer comprising a silica component obtained by curing the composition for forming the silica layer of claim 9 .

12. An electronic device comprising the silica layer of claim 11 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Noh Kunbae
• Kwak Taeksoo
• Jang Junyoung
• Koo Yoonyoung
• Kim Yonggoog
• Kim Jingyo
• Bae Jin-Hee
• Sakong Jun
• Seo Jinwoo
• Sim Sooyeon
• Yun Huichan
• Lee Jiho
• Han Kwen-Woo
• Hwang Byeong Gyu

Classifications

• H10P50/642

  Chemical etching · CPC title

• H10P14/6903

  containing silicon · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/6686

  the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane · CPC title

• H10P14/6689

  the compound being a silazane · CPC title