Substrate processing apparatus
US-2017291274-A1 · Oct 12, 2017 · US
Polishing apparatus
US11517996B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11517996-B2 |
| Application number | US-202016898599-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 11, 2020 |
| Priority date | Sep 10, 2019 |
| Publication date | Dec 6, 2022 |
| Grant date | Dec 6, 2022 |
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Abstract
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A polishing apparatus according to an embodiment includes a polishing pad including a polishing surface for polishing a polishing target object and a membrane including a contact surface that is in contact with the polishing target object on the opposite side of the polishing surface. The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane.
First claim
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The invention claimed is: 1. A polishing apparatus comprising: a polishing pad including a polishing surface for polishing a polishing target object; and a membrane including a contact surface that is in contact with the polishing target object on an opposite side of the polishing surface, wherein the contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane, and wherein the membrane includes: an elastic member configured to be elastically deformed in response to the pressure; and hard materials having hardness higher than hardness of the elastic member, and the hard materials form convex portions on the uneven surface, and wherein the hard materials are not in contact with the polishing target object. 2. The polishing apparatus according to claim 1 , wherein the hard materials are glass beads or glass fibers. 3. The polishing apparatus according to claim 1 , wherein the hard materials are dotted in the elastic member. 4. The polishing apparatus according to claim 1 , further comprising: an air source configured to supply compressed air to the elastic member; and a valve configured to adjust pressure of the compressed air.
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- What does patent US11517996B2 cover?
- A polishing apparatus according to an embodiment includes a polishing pad including a polishing surface for polishing a polishing target object and a membrane including a contact surface that is in contact with the polishing target object on the opposite side of the polishing surface. The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to t…
- Who is the assignee on this patent?
- Kioxia Corp
- What technology area does this patent fall under?
- Primary CPC classification B24B37/30. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).