Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Patent metadata

Field	Value
Publication number	US-11516924-B2
Application number	US-202016787169-A
Country	US
Kind code	B2
Filing date	Feb 11, 2020
Priority date	Nov 8, 2016
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

First claim

What is claimed is:

1. A method of manufacturing a printed circuit board assembly, the method comprising:
providing a circuit board;
positioning a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;
positioning a customized protective heat shield on the thermally-sensitive component, wherein the customized protective heat shield covers the thermally-sensitive component but exposes non-thermally-sensitive components of the plurality of components on the circuit board;
exposing the circuit board, the plurality of components, and the customized protective heat shield to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; and
removing the customized protective heat shield from the thermally-sensitive component.

2. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.

3. The method according to claim 2 , wherein the thermally-sensitive component and the customized protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.

4. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally sensitive component after positioning of the thermally-sensitive component on the circuit board.

5. The method according to claim 1 , wherein positioning the customized protective heat shield on the thermally-sensitive component includes engaging the customized protective heat shield with the thermally-sensitive component.

6. The method according to claim 1 , wherein positioning the customized protective heat shield on the thermally sensitive component includes receiving a connector of the thermally-sensitive component within an opening defined within the customized protective heat shield.

7. The method according to claim 1 , wherein the customized protective heat shield is 3D printed and formed of a high temperature grade plastic.

8. The method according to claim 1 , wherein the customized protective heat shield is shaped complementary to at least a portion of the thermally-sensitive component.

9. The method according to claim 1 , wherein exposing the circuit board to a high temperature environment includes at least one of: passing the circuit board through a reflow machine or passing the circuit board through a wave solder machine.

10. A method of manufacturing a printed circuit board assembly, comprising:
positioning a plurality of components on a circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;
positioning a protective heat shield on the thermally-sensitive component, wherein the protective heat shield covers the thermally-sensitive component but exposes non-thermally-sensitive components of the plurality of components on the circuit board;
exposing the circuit board, the plurality of components, and the protective heat shield to a high temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; and
removing the protective heat shield from the thermally-sensitive component.

11. The method according to claim 10 , wherein the heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.

12. The method according to claim 11 , wherein the thermally-sensitive component and the protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.

13. The method according to claim 10 , wherein the protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally-sensitive component on the circuit board.

14. The method according to claim 10 , wherein positioning the protective heat shield on the thermally-sensitive component includes engaging the protective heat shield with the thermally-sensitive component.

15. The method according to claim 10 , wherein positioning the protective heat shield on the thermally-sensitive component includes receiving a connector of the thermally-sensitive component within an opening defined within the customized protective heat shield.

16. The method according to claim 10 , wherein the protective heat shield is 3D printed and formed of a high temperature grade plastic.

17. The method according to claim 10 , wherein the protective heat shield is shaped complementary to at least a portion of the thermally-sensitive component.

18. A method of manufacturing a printed circuit board assembly, comprising:
positioning a plurality of components on a circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;
positioning a protective heat shield on the thermally-sensitive component, the protective heat shield conforming to a shape of a portion of the thermally-sensitive component, wherein the protective heat shield covers the thermally-sensitive component but exposes non-thermally sensitive components of the plurality of components on the circuit board;
exposing the circuit board, the plurality of components, and the protective heat shield to a high temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; and
removing the protective heat shield from the thermally-sensitive component.

19. The method according to claim 18 , wherein the heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.

20. The method according to claim 18 , wherein the protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally-sensitive component on the circuit board.

Assignees

• Flex Ltd

Inventors

• Mehkri Zohair
• Mohammed Anwar
• Tan Jesus
• Geiger David
• Kurwa Murad

Classifications

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H05K3/0005

  for designing circuits by computer · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K1/008

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• B23K1/085

  Wave soldering · CPC title