Glass wiring board

Patent metadata

Field	Value
Publication number	US-11516907-B2
Application number	US-202017122775-A
Country	US
Kind code	B2
Filing date	Dec 15, 2020
Priority date	Jun 19, 2018
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.

First claim

What is claimed is:

1. A glass wiring board, comprising:
a glass plate;
a first metal layer covering at least a part of the glass plate; and
a second metal layer covering at least a part of the first metal layer, wherein
an area of the first metal layer in contact with the second metal layer is smaller than an area of the second metal layer facing the first metal layer; and,
the second metal layer is an electrolytic copper plating layer.

2. The glass wiring board of claim 1 , wherein the first metal layer is formed by stacking a plurality of metals.

3. The glass wiring board of claim 2 , wherein in the first metal layer, titanium, copper, and electroless nickel-phosphorus plating are sequentially stacked from the glass plate, and a palladium-containing material is disposed between a layer of the copper and a layer of the electroless nickel-phosphorus plating.

4. The glass wiring board of claim 1 , wherein the second metal layer is eroded around an outer periphery of a surface in contact with the first metal layer.

5. The glass wiring board of claim 1 , wherein the second metal layer is eroded around an outer periphery of a surface in contact with the first metal layer.

6. The glass wiring board of claim 1 , wherein a coefficient of linear expansion of the glass plate is within a range of 0.5×10 −6 /K or more and 160×10 −6 /K or less for each temperature within a temperature range of 20° C. or more and 260° C. or less.

7. The glass wiring board of claim 1 , wherein a coefficient of linear expansion of the glass plate is within a range of range of 1.0×10 −6 /K or more and 8.0×10 −6 /K or less for each temperature within a temperature range of 20° C. or more and 260° C. or less.

Assignees

• Toppan Printing Co Ltd

Inventors

• Tsuchida Tetsuyuki

Classifications

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• C03C17/40 Primary

  all coatings being metal coatings · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/0341

  Intermediate metal, e.g. before reinforcing of conductors by plating · CPC title