Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
US-2017342567-A1 · Nov 30, 2017 · US
Method for electroless plating
US9822034B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9822034-B2 |
| Application number | US-201214116810-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2012 |
| Priority date | May 17, 2011 |
| Publication date | Nov 21, 2017 |
| Grant date | Nov 21, 2017 |
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Abstract
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The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for electroless plating comprising in this order the steps of (i) providing a non-conductive substrate having on at least one side attached thereto a metal or metal alloy structure selected from the group consisting of molybdenum, titanium, zirconium, aluminium, chromium, tungsten, niobium, tantalum and alloys thereof, (ii) contacting said substrate with an activator comprising palladium ions, (iii) contacting said substrate with an aqueou…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C23C18/1889Primary
Chemistry & Metallurgy · mapped topic
- C03C17/40Primary
Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
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- What does patent US9822034B2 cover?
- The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plat…
- Who is the assignee on this patent?
- Brüning Frank, Beck Birgit, Dosse Bexy, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification C23C18/1889. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).