Chip-scale optical interconnect using microLEDs

Patent metadata

Field	Value
Publication number	US-11515356-B2
Application number	US-202016913905-A
Country	US
Kind code	B2
Filing date	Jun 26, 2020
Priority date	Jun 27, 2019
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.

First claim

What is claimed is:

1. An optical communications system for semiconductor chips on a common substrate, comprising:
a plurality of first microLEDs on a first semiconductor chip, the first semiconductor chip electrically coupled to a substrate;
a plurality of first photodetectors part of a second semiconductor chip, the second semi-conductor chip electrically coupled to the substrate;
a plurality of waveguides, each of the plurality of waveguides coupling different ones of the plurality of first microLEDs with different ones of the plurality of first photodetectors;
a plurality of second microLEDs on the second semiconductor chip;
a plurality of second photodetectors part of the first semiconductor chip; and
a further plurality of waveguides, each of the further plurality of waveguides coupling different ones of the plurality of second microLEDs with different ones of the plurality of second photodetectors;
wherein the first semiconductor chip includes first drive circuitry for driving the plurality of first microLEDs and first receive circuitry for processing signals generated by the plurality of second photodetectors, and the second semiconductor chip includes second drive circuitry for driving the plurality of second microLEDs and second receive circuitry for processing signals generated by the plurality of first photodetectors; and
further comprising a semiconductor package;
wherein the plurality of first microLEDs and the first semiconductor chip are in the semiconductor package; and
wherein the plurality of first photodetectors and the second semiconductor chip are in the semiconductor package.

2. The optical communication system of claim 1 , wherein the first semiconductor chip comprises a first transceiver die and the second semiconductor chip comprises a second transceiver die, and further comprising:
a third semiconductor chip electrically coupled to the first transceiver die; and
a fourth semiconductor chip electrically coupled to the second transceiver die.

Assignees

• Pezeshki Bardia
• Kalman Robert
• Avicenatech Corp

Inventors

• Pezeshki Bardia
• Kalman Robert

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/4214

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/12002

  Three-dimensional structures · CPC title