Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
US11515231B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11515231-B2 |
| Application number | US-202016931560-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 17, 2020 |
| Priority date | Aug 27, 2019 |
| Publication date | Nov 29, 2022 |
| Grant date | Nov 29, 2022 |
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A coating method applied to perform coating with liquid metal thermal grease and a heat dissipation module are provided. The coating method includes: providing liquid metal thermal grease on a surface of an electronic element, and scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease. A surface of the scraper is roughened. According to the coating method, the surface of the electronic element is evenly coated with the liquid metal thermal grease effectively.
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What is claimed is: 1. A coating method, applied to coat an electronic element with liquid metal thermal grease, wherein the coating method comprises: applying the liquid metal thermal grease on a surface of the electronic element by using a limiting element that limits lateral boundaries of the liquid metal thermal grease; scraping the liquid metal thermal grease by a scraper, to coat the surface of the electronic element with the liquid metal thermal grease to form a first liquid metal thermal grease layer, wherein a surface of the scraper is roughened; removing the limiting element; after removing the limiting element, applying additional liquid metal thermal grease on the first liquid metal thermal grease layer without any limiting element; and evenly distributing the additional liquid metal thermal grease on a top surface of the first liquid metal thermal grease layer by affinity between homogeneous molecules of the liquid metal thermal grease, wherein the additional liquid metal thermal grease does not overrun the lateral boundaries of the first liquid metal thermal grease layer. 2. The coating method according to claim 1 , further comprising a step of disposing the limiting element on the electronic element, a lower surface of the limiting element is against the surface of the electronic element, and at least a part of the surface of the electronic element is exposed from an opening of the limiting element. 3. The coating method according to claim 1 , wherein the step of providing the liquid metal thermal grease on the surface of the electronic element by using the limiting element comprises: providing a predetermined amount of the liquid metal thermal grease to an area of the limiting element. 4. The coating method according to claim 3 , wherein after the step of scraping the liquid metal thermal grease by the scraper, providing another predetermined amount of the liquid metal thermal grease to the area of the limiting element. 5. The coating method according to claim 1 , wherein the surface of the scraper is roughened through polishing, sand blasting, or chemical etching. 6. The coating method according to claim 1 , wherein the liquid metal thermal grease comprises at least gallium or a gallium compound, and content of the gallium or the gallium compound is at least more than 85%. 7. A coating method, applied to perform coating with liquid metal thermal grease, wherein the coating method comprises: applying the liquid metal thermal grease on a surface of a scraper; smearing a surface of an electronic element by using a limiting element and the surface of the scraper to form a first liquid metal thermal grease layer, wherein the surface of the scraper is roughened, and wherein the limiting element limits lateral boundaries of the liquid metal thermal grease; removing the limiting element; after removing the limiting element, applying additional liquid metal thermal grease on the first liquid metal thermal grease layer without any limiting element; and evenly distributing the additional liquid metal thermal grease on a top surface of the first liquid metal thermal grease layer by affinity between homogeneous molecules of the liquid metal thermal grease, wherein the additional liquid metal thermal grease does not overrun the lateral boundaries of the first liquid metal thermal grease layer. 8. The coating method according to claim 7 , where before the step of smearing the surface of the electronic element by using the limiting element and the surface of the scraper, further comprising a step of: disposing the limiting element on the electronic element, so that a lower surface of the limiting element is against the surface of the electronic element, and at least a part of the surface of the electronic element is exposed from an opening of the limiting element.
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title
to obtain a coating with specific electrical properties · CPC title
Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36 · CPC title
Solid materials, e.g. powdery or granular · CPC title
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